Enhance your signal connectivity with the MICT,788PLUG,190,ASSY,.025,REC board-to-board connector. Designed for high-speed data transmission at 10 Gb/s, this vertical-mount connector features 190 signal positions in a dual-row layout, ensuring reliable performance in demanding applications. With a contact impedance of 50 Ω and a contact amperage of 11.5 A, it meets CSA and UL standards for safety and quality. The housing, made of LCP, offers exceptional durability with a flammability rating of UL 94V-0. Gold plating on the contact mating area guarantees efficient power transfer, while the tin-lead plating on the PCB contacts ensures secure mounting on boards with a thickness of 1.57 mm. Operating in a wide temperature range from -67 to 257 °F, this connector is suitable for various environments. Its innovative dual-beam contact shape and differential signaling capability make it ideal for data and devices applications. The connector is RoHS compliant, providing peace of mind for environmentally conscious projects. Whether you're assembling complex circuitry or optimizing signal paths, this high-performance connector is the perfect choice for your connectivity needs.
Availability
Immediate Shipment: NA
Stock Location: In Stock
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Unit Of Measure:
Minimum/Multiple: 1/1
Pricing
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Product Category:
Manufacturer: TE Connectivity
Manufacturer Part Number: 1-767032-9
Housing Material: LCP (Liquid Crystal Polymer)
Number of Rows: 2
Mount Type: Board Mount
Termination Method: Surface Mount
Contact Material: Copper Alloy
Pitch: .025 in, .64 mm
Voltage: 30 V AC, 5 V DC
Contact Type: Pin
Row Spacing: .228 in, 5.79 mm
Impedance: 50 Ω
Package Quantity: 7
Contact Amperage: 11.5 A
Number of Positions: 190
Data Rate: 10 Gb/s
Housing Color: Black
Mount Orientation: Vertical
Insulation Resistance: 2 MΩ
GPL: 481
Packaging: Box & Tube, Tube
Operating Temperature Range: -67 - 257 °F
Circuit Application: Signal
Contact Mating Area Plating: Gold
Contact Mating Area Plating Thickness: 30 µin, .76 µm
PCB Retention: With
PCB Contact Termination Area Plating: Tin-Lead
PCB Thickness (Recommended): 1.57 mm, .8 in
Connector Height: 19.812 mm, .78 in
PCB Retention Type: Boardlock
Sealable: No
Ground Component Type: Ground Bus
Mating Alignment: Without
GPL Description: Data and Devices
Connector and Contact Terminate To: Printed Circuit Board
Product Code: 3124
Number of Columns: 95
Number of Power Positions: 5
Number of Signal Positions: 190
Contact Layout: Inline
Connector Length: 3 in, 76.2 mm
Connector System: Board to Board
CSA Agency Certification: 1195944
UL Agency Certification: E28476
Stackable: No
ECCN: EAR99
Board to Board Configuration: Mezzanine
Contact Shape: Dual Beam
Connector Width: .32 in, 8.128 mm
Mating Retention: With
PCB Mount Alignment: With
PCB Mount Alignment Type: Boardlock, Locating Posts
Application Assembly Feature: None
Differential Signaling: Yes
Header Type: Header Only
Connector Assembly Type: PCB Mount Header
Stack Height: 1.143 in, 20 mm, 29 mm
PCB Contact Termination Area Plating Thickness: 150 - 250 µin
Standards Met: CSA
Material Flammability Standard: UL 94V-0
Part Aliases: 1-767032-9
SKU: AMP1-767032-9

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes: