Enhance your circuit connections with this cutting-edge MICT board-to-board connector, meticulously designed for high-performance applications. Featuring dual-beam contact shapes and a 190-position layout, it ensures reliable signal transmission at an impressive data rate of 10 Gb/s. With housing crafted from UL 94V-0 rated liquid crystal polymer, it guarantees robustness and safety in operation. The gold or palladium nickel plating on the contact mating area offers optimal conductivity, while the tin-lead plating on the PCB contact terminals ensures secure attachment. Meeting stringent standards such as CSA and UL certifications, this connector is ideal for demanding environments. Its innovative design, including a vertical mount orientation and mezzanine board-to-board configuration, enables seamless integration into your electronic systems. Whether used in industrial machinery or telecommunications equipment, its 30 V AC and 5 V DC voltage ratings, along with an impedance of 50 Ω, make it versatile for various applications. Trust in the reliability and performance of this MICT board-to-board connector for your connectivity needs.
Availability
Immediate Shipment: NA
Stock Location: In Stock
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Unit Of Measure:
Minimum/Multiple: 1/1
Pricing
CALL: 800.400.7041
Product Category:
Manufacturer: TE Connectivity
Manufacturer Part Number: 1-767114-2
Housing Material: Liquid crystal polymer(LCP)
Number of Rows: 2
Mount Type: Board Mount
Termination Method: Surface Mount
Contact Material: Copper Alloy
Pitch: 24.003 mm, .64 mm, .945 in
Voltage: 30 V AC, 5 V DC
Contact Type: Socket
Row Spacing: .228 in, 5.79 mm
Impedance: 50 Ω
Package Quantity: 252
Contact Amperage: 11.5 A
Number of Positions: 190
Data Rate: 10 Gb/s
Housing Color: Black
Mount Orientation: Vertical
Insulation Resistance: 2 MΩ
GPL: 481
Mating Entry Location: Bottom
Packaging: Tape
Operating Temperature Range: -67 - 257 °F
Circuit Application: Signal
Contact Mating Area Plating: Gold or Palladium Nickel or Performance Based
Contact Mating Area Plating Thickness: 30 µin, .76 µm
PCB Retention: With
PCB Contact Termination Area Plating: Tin-Lead
PCB Thickness (Recommended): 1.57 mm, .8 in
Connector Height: .24 in, 6.096 mm
Sealable: No
Ground Component Type: Ground Bus
Mating Alignment: With
GPL Description: Data and Devices
Connector and Contact Terminate To: Printed Circuit Board
Product Code: 2429
Number of Columns: 95
Number of Power Positions: 5
Number of Signal Positions: 190
Contact Layout: Inline
Connector Length: 3 in, 76.2 mm
Connector System: Board to Board
CSA Agency Certification: 1195944
UL Agency Certification: E28476
Stackable: No
ECCN: EAR99
Board to Board Configuration: Mezzanine
Contact Shape: Dual Beam
Connector Width: .272 in, 6.9 mm
Mating Retention: With
PCB Mount Alignment: With
PCB Mount Alignment Type: Locating Posts
Differential Signaling: Yes
Header Type: Header Only
Connector Assembly Type: PCB Mount Receptacle
Stack Height: 10.92 mm, 12.57 mm, 17.96 mm, 18.75 mm, 20 mm, 22.86 mm, 6.6 mm, .9 in, 9 mm
PCB Contact Termination Area Plating Thickness: 150 - 250 µin
Standards Met: CSA
Material Flammability Standard: UL 94V-0
Part Aliases: 1-767114-2
Replacement Part: 1-5767114-2
SKU: AMP1-767114-2

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes: