| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 1963838-2 |
| Series: | QSFP/QSFP+ |
| Accessory Type: | Heat Sink |
| Data Interface: | QSFP+ |
| GPL: | J33 |
| Packaging: | Box & Tray |
| GPL Description: | Data and Devices |
| Product Code: | L030 |
| Connector Product Type: | Accessory |
| ECCN: | EAR99 |
| Heat Sink Style: | Pin |
| Heat Sink Height Class: | Custom |
| Heat Sink Height: | .165 in, 4.2 mm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 1963838-2 |
| SKU: | AMP1963838-2 |
1963838-2
Specifications
Detailed Description
Enhance the cooling performance of your QSFP/QSFP+ connectors with this ganged PCI extrusion heat sink. Measuring at a compact 4.2mm tall, it efficiently dissipates heat to keep your devices running smoothly. Featuring a UL 94V-0 flammability standard, it ensures safety in operation. Designed for QSFP+ data interfaces, this accessory comes in a box and tray packaging for convenience. With lead-free solder processes and RoHS compliance, it's both environmentally friendly and high-performing. Perfect for high-speed connector assemblies, it guarantees optimal connectivity for your devices.
Availability
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Minimum/Multiple:
1/1
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Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |