2-2013289-2

EMBOSS TAPE DDR3 204P 5.2H STD Au 0.25

Enhance the connectivity of your DDR3 memory modules with our high-quality EMBOSS TAPE DDR3 204P 5.2H STD Au 0.25 female socket. Designed for optimal performance, this socket features a durable housing made of high-temperature thermoplastic and gold-plated copper alloy contacts, ensuring reliable power transmission. With a right-angle body orientation and board mount design, it offers easy integration onto your circuit boards. Meeting UL 94V-0 standards, it guarantees safety and compliance. Suitable for DDR3 SDRAM modules, this memory card socket accommodates 204 contacts in a 2-row configuration, with a pitch of .6mm. Operating at a maximum temperature of 85°C and rated for 1.5V, it is ideal for various electronic applications. The socket comes in a package of 200, with emboss on reel packaging for convenience. RoHS compliant and ECCN classified as EAR99, it meets international quality and regulatory standards. Upgrade your memory module connections with this reliable and efficient DDR3 socket.
Availability
Immediate Shipment: NA
Stock Location: In Stock
Factory Stock: Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple: 1/1
Pricing
CALL: 800.400.7041
Product Category:
Manufacturer: TE Connectivity
Manufacturer Part Number: TE Connectivity 2-2013289-2
Amperage: .5 A
Gender: Female
Housing Material: High Temperature Thermoplastic
Number of Contacts: 204
Number of Rows: 2
Mount Type: Board Mount
Contact Material: Copper Alloy
Contact Plating: Gold
Maximum Operating Temperature: 85 °C
Body Orientation: Right Angle
Pitch: .024 in, .6 mm
Voltage: 1.5 V
Socket Type: Memory Card
Row Spacing: .322 in, 8.2 mm
Keying: Standard
SDRAM Type: DDR3
Package Quantity: 200
Key Type: SGRAM
Latch Material: Stainless Steel
Contact Amperage: .5 A
Number of Positions: 204
Housing Color: Black
GPL: 053
Profile: Standard
Packaging: Emboss on Reel
Operating Temperature Range: -55 - 85 °C, -67 - 185 °F
Circuit Application: Power
Contact Mating Area Plating: Gold
Contact Mating Area Plating Thickness: 10 µin, .254 µm
PCB Retention: With
PCB Contact Termination Area Plating: Gold
PCB Retention Type: Solder Peg
Sealable: No
GPL Description: Data and Devices
Connector and Contact Terminate To: Printed Circuit Board
Product Code: E374
Connector System: Cable-to-Board
ECCN: EAR99
Stack Height: .205 in, 5.2 mm
Ejector Type: Locking
PCB Mounting Style: Surface Mount
Ejector Location: Both Ends
Latch Plating: Tin
Center Key: Offset Left
DRAM Type: DDR3
Insertion Style: Cam-In
Socket Style: SO DIMM
Module Orientation: Right Angle
Standards Met: UL 94V-0
Material Flammability Standard: UL 94V-0
Part Aliases: 2-2013289-2
SKU: AMP2-2013289-2

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes: