2229333-2
PUSH-PUSH MICRO SIM CONNECTOR SMT-2 TYPE
Discover seamless connectivity with our Push-Push Micro SIM Connector, designed for SMT-2 Type applications. Engineered for reliability, this connector features a compact design and is perfect for board mount installations. With a copper alloy contact material ensuring efficient performance, it is compatible with 3FF SIM cards. The black housing, along with a tape packaging option, adds convenience to the assembly process. Operating flawlessly in a temperature range of -30 to 85°C, this connector is ideal for signal circuit applications. Its push-push ejector type and card guide slots offer ease of use, while being fully RoHS compliant. Elevate your connectivity solutions with this essential component.
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2229333-2 |
| Series: | SIM Connectors |
| Number of Contacts: | 6 |
| Mount Type: | Board Mount |
| Contact Material: | Copper Alloy |
| Maximum Operating Temperature: | 85 °C |
| Pitch: | .1 in, 2.54 mm |
| Compatible Card Type: | 3FF SIM |
| Package Quantity: | 1050 |
| Contact Amperage: | .5 A |
| Number of Positions: | 6 |
| Housing Color: | Black |
| Module Type: | SIM (Security Identity Module) |
| GPL: | K86 |
| Packaging: | Tape |
| Operating Temperature Range: | -22 - 185 °F, -30 - 85 °C |
| Circuit Application: | Signal |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | L902 |
| ECCN: | EAR99 |
| Ejector Type: | Push-Push |
| Card Insertion Style: | Normal Insertion |
| Connector Stabilization Ribs: | Without |
| PCB Mounting Style: | Surface Mount |
| Card Guide Slots: | With |
| Card Stop: | With |
| Part Aliases: | 2229333-2 |
| SKU: | AMP2229333-2 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 03/01/2020 | P-19-018353 - Manufacturing location change - the products listed below are being moved from TE Shanghai to TE Guangdong. | Download |
| 03/01/2020 | P-20-018469- PCN correction Location change. As previously notified in PCNs P-19-018353 & P-19-018356, TE has announced the closure of the Data & Devices Shanghai East manufacturing facility. The PNs listed below were originally planned to move from TE Shanghai to TE Guangdong, however, the PNs listed below will now be transferred from TE Shanghai to TE Qingdao. | Download |