2299870-4

Heilind Number:AMP2299870-4
Manufacturer:TE Connectivity
Manufacturer Number:2299870-4
Datasheet:Drawing
ECAD Model:
3D Model

Description:

THERMAL ZQSFP+ STACKED REC ASSEMBLY 2X2

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2299870-4
Series:zQSFP+/QSFP28
Mount Type:Board Mount
Termination Method:Through Hole - Press-Fit
Number of Ports:4
Data Interface:zQSFP+
Number of Positions:38
Data Rate:25 Gb/s
Application:Thermally Enhanced
GPL:J25
Port Matrix Configuration:2 x 2
Tail Length:.079 in, 2 mm
Packaging:Box & Tray
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µm, .76 µin
Contact Underplating Material:Tin
PCB Contact Termination Area Plating:Gold
PCB Thickness (Recommended):.062 in, 1.57 mm
Sealable:No
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:L818
EMI and RFI Protection Type:Internal/External EMI Springs
Connector System:Cable-to-Board
Connector Product Type:Cage Assembly with Integrated Connector
ECCN:EAR99
Heat Sink Style:Fin
Cage Type:Stacked
Heat Sink Finish:Anodized Black
Rear EONs Per Port Column:3
Cage Material:Nickel Silver
Heat Sink Compatible:Yes
Lightpipe Included:No
Enhancements:Thermally Enhanced
Included Accessory:Heat Sink
Material Flammability Standard:UL 94V-0
Part Aliases:2299870-4
SKU:AMP2299870-4

Detailed Description

Enhance thermal management in your high-speed data applications with this zQSFP+ Stacked Receptacle Assembly. Designed for board mounting with through-hole press-fit termination, this assembly features four ports in a 2x2 matrix configuration. With a data rate of 25 Gb/s and 38 positions, it ensures reliable signal transmission. The thermally enhanced design, along with gold plating and a nickel silver cage, provides optimal performance. RoHS compliant and UL 94V-0 rated, it meets stringent quality standards. Perfect for demanding environments, this assembly is a key component for ensuring efficient data connectivity.