2306654-3

SPRING FINGER 1.8H

The ultra-small Spring Finger 1.8H, a crucial component for power and signal circuit applications. Crafted from durable stainless steel with a gold contact mating area plating, this high-quality connector ensures reliable performance. With a contact length of 2.4mm and width of 1mm, it offers precise connectivity in tight spaces. Side-protected and operating within a temperature range of -40 to 85°F, it guarantees longevity and stability. RoHS compliant and suitable for lead-free solder processes, it meets the highest industry standards. Ideal for board-to-board connections, this versatile component comes in a package of 7000, making it perfect for large-scale projects. Upgrade your electronic systems with the Spring Finger 1.8H for seamless connectivity and superior functionality.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL:800.400.7041
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2306654-3
Contact Material:Stainless Steel
Contact Length:.094 in, 2.4 mm
Contact Width:.039 in, 1 mm
Package Quantity:7000
Contact Amperage:1 A
Number of Positions:1
GPL:K85
Operating Temperature Range:-40 - 85 °F
Circuit Application:Power & Signal
Contact Mating Area Plating:Gold
Contact Underplating Material:Nickel
PCB Contact Termination Area Plating:Gold
Sealable:No
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:F211
Connector System:Board to Board
ECCN:EAR99
Height:.071 in, 1.8 mm
Scalable:No
Spring Finger Type:Ultra Small - C-Clip
Side Protected:Yes
Contact Working Range High:.035 in, .9 mm
Contact Working Range Low:.055 in, 1.4 mm
Part Aliases:2306654-3
SKU:AMP2306654-3

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
02/01/2024P-23-025431 - Assembly Line Transfer. We plan to outsource TE existing assembly lines (i.e. transfer existing assembly lines to TE's suppliers). Target transfer schedule to be finished by the end of January 2024.
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