282857-4

Heilind Number:AMP282857-4
Manufacturer:TE Connectivity
Manufacturer Number:282857-4
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

TERMI-BLOK PCB MOUNT 90 4P.5

More >>

Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 282857-4
Amperage:24 A
Gender:Header
Housing Material:PA 6/6
Number of Contacts:4
Number of Rows:1
Mount Type:Board Mount
Contact Material:Brass
Pitch:.2 in, 5.08 mm
Voltage:300 V AC
Mount Angle:Straight
Block Type:Stacking w/interlock
Screw Size:M3
Contact Amperage:24 A
Number of Positions:4
Housing Color:Green
GPL:124
Tail Length:.138 in, 3.5 mm
Operating Temperature Range:-40 - 110 °C, -40 - 230 °F
Circuit Application:Power & Signal
Contact Mating Area Plating:Tin
GPL Description:Industrial
Connector and Contact Terminate To:Printed Circuit Board
Product Code:7742
Wire Size:.05 - 3 mm², 12 - 30 AWG
Connector System:Wire to Board
Screw Material:Brass
ECCN:EAR99
Screw Plating:Nickel
Entry Angle:Side
Interlock:With
Contact Mount Style:Through Hole
Screw Flange:Without
Screwless Terminal Block:No
Wire Protection:With
Part Aliases:282857-4
SKU:AMP282857-4

Detailed Description

TERMI-BLOK PCB MOUNT 90 4P.5 is a versatile solution for power and signal connections on printed circuit boards. With a straight board mount, this header features a stacking design with an interlock for secure connections. The housing, made of durable PA 6/6 in a vibrant green color, can accommodate up to four contacts in a single row. Each contact, constructed of brass with tin plating, is suitable for wire sizes ranging from 12 to 30 AWG. Rated for 24 A and 300 V AC, this connector is designed for industrial applications, with an operating temperature range of -40 to 110°C (-40 to 230°F). RoHS compliant and suitable for lead-free solder processes, it offers reliable performance in demanding environments. With wave solder capability and M3 screw size, it ensures easy installation on PCBs. Overall, the TERMI-BLOK header combines robust construction, efficient connectivity, and compliance with international standards for seamless integration in various electronic systems.