Experience reliable and high-performance connectivity with our MIL-PRF-29504 compliant board-to-board PCB connectors. These connectors feature a durable construction with high-temperature thermoplastic housing, copper alloy contacts with gold plating, and UL 94V-0 rated black housing. With a pitch of .5mm, they offer a compact yet efficient solution for signal transmission. Their surface mount termination method and straight body orientation ensure easy and secure installation. Operating in a wide temperature range from -40 to 185°F, they guarantee consistent performance in various environments. With 440 positions and a voltage rating of 50V AC, these connectors are suitable for a wide range of applications. The stackable design with a stack height of .472in allows for efficient board stacking, making them ideal for mezzanine and board-to-board configurations. Meeting RoHS compliance and with an ECCN of EAR99, these connectors are not only performance-driven but also environmentally friendly. Trust in their quality and durability for your connectivity needs.
Availability
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL:800.400.7041
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 3-5353652-6
Amperage:.5 A
Housing Material:High Temperature Thermoplastic
Number of Rows:2
Mount Type:Board Mount
Termination Method:Surface Mount
Contact Material:Copper Alloy
Contact Plating:Gold
Body Orientation:Straight
Pitch:.02 in, .5 mm
Voltage:50 V AC
Contact Type:Pin
Package Quantity:18
Contact Amperage:.5 A
Number of Positions:440
Housing Color:Black
Mount Orientation:Vertical
Insulation Resistance:2 MΩ
GPL:312
Packaging:Hard Tray
Operating Temperature Range:-40 - 185 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.2 µm, 7.874 µin
PCB Retention:With
PCB Contact Termination Area Plating:Tin
PCB Thickness (Recommended):.2 in
Connector Height:.314 in, 8 mm
PCB Retention Type:Solder Peg
Ground Component Type:Grounding Contact, Grounding Plate
Mating Alignment:With
Mating Alignment Type:Polarization
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:A198
Contact Layout:Inline
Connector System:Board to Board
Stackable:Yes
ECCN:EAR99
Dielectric Withstanding Voltage:200 V AC
Board to Board Configuration:Mezzanine
PCB Mount Alignment:With
PCB Mount Alignment Type:Locating Posts
Application Assembly Feature:Vacuum Cover
Connector Assembly Type:PCB Mount Header
Stack Height:12 mm, .472 in, 8 mm, 9 mm
PCB Contact Termination Area Plating Thickness:1 µm, 39.37 µin
Contact Mating Area Length:1.3 mm, 1 mm
Temperature Rating:High
Material Flammability Standard:UL 94V-0
Part Aliases:3-5353652-6
SKU:AMP3-5353652-6

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
02/01/2024P-23-025452 - Manufacturing location change. Following Part Numbers will be transferred from TE leased site in Qingdao high tech zone to TE main campus in Qingdao for Data and Devices business unit. Qingdao high tech zone also runned by TE production under TE quality control system. Operator/Tooling/Process is not changed and just manufacturing location change
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01/08/2023PCN-22-157376 - Tray Change. Add a littler error feature in hard tray To be better efficiency visual inspection in plant. To better visual inspection and consider modifying package Consider an error-proof method in hard tray to convenient inspector to appearance inspection
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08/07/2022PCN-22-135638 - Drawing change. plant requirement to remove tray hole to avoid operator to touch connector contacts, Remove tray hole to be better to protect connector not touching by operators in packaging
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06/27/2022P-22-022958 - Manufacturing Location Change. Following Part Numbers will be transferred from current TE Connectivity AMP Qingdao manufacturing location, CHINA to new manufacturing location- TE AMP Qingdao Ltd. High-tech Zone Branch is 11KM from TE current Campus, which was located in Graphene Industrial Park in Qingdao.
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08/24/2021PCN-21-111259 - customer request. add mated condition info in the drawingsDownload
07/30/2020E-20-005263 - Product Improvement. 1)correct default tolerance and cap view. 2) 4H rec ground contact solder tail plating change from tin to gold flashDownload
01/31/2018E-17-007964 - Document Clarification. Change the resin from Vectra C130 PN 1573880 to Vectra E130i PN 1573878-2.Download