5-2267254-6

Heilind Number:AMP5-2267254-6
Manufacturer:TE Connectivity
Manufacturer Number:5-2267254-6
ECAD Model:
3D Model

Description:

60 50/50 GRID DRST TH RCPT

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5-2267254-6
Amperage:.5 A
Housing Material:Liquid Crystal Polymer
Number of Rows:2
Termination Method:Through Hole - Solder
Contact Material:Copper Alloy
Pitch:.05 in, 1.27 mm
Contact Type:Receptacle
Row Spacing:.05 in, 1.27 mm
Number of Positions:60
Mount Orientation:Vertical
Contact Mating Area Plating:Gold
Stack Height:.25 in, .32 in, .39 in, 6.35 mm, 8.12 mm, 9.9 mm
Product:Board-to-Board Headers & Receptacles
SKU:AMP5-2267254-6

Detailed Description

Power your electronic connections with this high-quality board-to-board receptacle. Designed for seamless integration with a pitch of 1.27mm (.05 in) and a vertical mount orientation, it offers reliable performance in through-hole soldering applications. With 60 positions spread across 2 rows, it ensures efficient connectivity. The housing, made of Liquid Crystal Polymer, guarantees durability while the gold-plated copper alloy contacts provide optimal conductivity. Its stack height options of .32 in, .39 in, and .25 in (.812 mm, 9.9 mm, 8.12 mm) cater to various board stacking requirements. Meeting stringent RoHS compliance standards, this connector is a sustainable choice for your PCB assembly needs. Ideal for use in Mezzanine & Board Stacking applications, it's a versatile solution for your electronic projects.