5223092-1
2MM FB,ASY,010,PWR,REC,5R,SEQ
Enhance your power connectivity with the Z-PACK Future Bus+ Connector. This high-performance board mount assembly features five rows of durable Phosphor Bronze contacts, perfect for transmitting power efficiently. With a pitch of 2mm, it offers reliable performance in various applications. The LCP housing material ensures durability, while the UL 94V-0 flammability standard provides added safety. Operating in a wide temperature range from -55 to 125°C, this connector is built to withstand harsh environments. Its gold-plated contact mating areas guarantee optimal conductivity, while the PCB retention feature adds stability during use. Designed for power applications, this connector is RoHS compliant and suitable for diverse industries. Elevate your power connections with the Z-PACK Future Bus+ Connector.
Product Category: | |
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Manufacturer: | TE Connectivity |
Manufacturer Part Number: | 5223092-1 |
Series: | Z-PACK Future Bus+ |
Housing Material: | LCP (Liquid Crystal Polymer) |
Number of Rows: | 5 |
Mount Type: | Board Mount |
Termination Method: | Through Hole - Press-Fit, Through Hole - Solder |
Contact Material: | Phosphor Bronze |
Pitch: | .079 in, 2 mm |
Voltage: | 30 V AC |
Contact Type: | Socket |
USOC Codes: | Futurebus+ |
Row Spacing: | .079 in, 2 mm |
Package Quantity: | 48 |
Contact Amperage: | 3 A, 5 A |
Number of Positions: | 10 |
Housing Color: | Natural |
Mount Orientation: | Right Angle |
GPL: | A87 |
Packaging: | Tube |
Operating Temperature Range: | -55 - 125 °C, -67 - 257 °F |
Circuit Application: | Power |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | 29.92 µin, .76 µm |
PCB Retention: | With |
Contact Termination Plating Thickness: | 149 µin, 3.81 µm |
Contact Underplating Material: | Palladium Nickel |
Connector Height: | 13.3 mm, .523 in |
PCB Retention Type: | Solder Leads |
Sealable: | No |
Mating Alignment Type: | Polarization |
GPL Description: | Data and Devices |
Connector and Contact Terminate To: | Printed Circuit Board |
Product Code: | 4271 |
Number of Power Positions: | 10 |
Contact Layout: | Matrix |
Connector System: | Board to Board |
Contact Termination Plating: | Tin |
Connector Product Type: | Connector Assembly |
Mating Post Length: | .226 in, 5.75 mm |
ECCN: | EAR99 |
Dielectric Withstanding Voltage: | 1000 V AC |
PCB Mount Alignment Type: | Locating Posts |
Application Solder Feature: | Board Standoff |
Termination Post Tail Length: | .107 in, 2.73 mm |
Contact Retention: | Without |
Glow Wire Rating: | Standard Part - Not Glow Wire |
Connector and Housing Type: | Receptacle |
Material Flammability Standard: | UL 94V-0 |
Part Aliases: | 5223092-1 |
SKU: | AMP5223092-1 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |