5223668-1
2MM FB,5RV,REC,ASY,030,PF,3.20
Enhance your signal connectivity with our Z-PACK Future Bus+ Board-to-Board Connector, offering reliable performance for your electronic applications. Featuring a high-density design with five rows and 30 positions, this connector is ideal for demanding signal transmission tasks. The vertical mount orientation and through-hole press-fit termination method ensure secure and stable PCB attachment, while the durable LCP housing and UL 94V-0 material flammability standard guarantee safety and longevity. With a contact layout optimized for signal integrity, phosphor bronze contacts with gold plating, and an impedance of 30Ω, this connector provides excellent electrical performance. Operating in a wide temperature range from -67 to 257°F, it is suitable for various environments. RoHS compliant and offering ECCN classification as EAR99, this connector meets international standards for environmental responsibility and export control. Perfect for data and devices applications, it is a versatile choice for your connectivity needs.
Product Category: | |
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Manufacturer: | TE Connectivity |
Manufacturer Part Number: | 5223668-1 |
Series: | Z-PACK Future Bus+ |
Housing Material: | LCP (Liquid Crystal Polymer) |
Number of Rows: | 5 |
Mount Type: | Board Mount |
Termination Method: | Through Hole - Press-Fit |
Contact Material: | Phosphor Bronze |
Pitch: | .079 in, 2 mm |
Voltage: | 30 V AC |
Contact Type: | Socket |
Impedance: | 30 Ω |
Package Quantity: | 43 |
Contact Amperage: | 3 A |
Number of Positions: | 30 |
Housing Color: | Natural |
Mount Orientation: | Vertical |
Insulation Resistance: | 5 MΩ |
GPL: | 473 |
Packaging: | Tube |
Operating Temperature Range: | -67 - 257 °F |
Circuit Application: | Signal |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
PCB Retention: | With |
Contact Underplating Material: | Nickel |
PCB Contact Termination Area Plating: | Tin |
PCB Thickness (Recommended): | 2.4 mm, .76 in |
Connector Height: | 14.3 mm, .562 in |
PCB Retention Type: | Action/Compliant Tail |
Sealable: | No |
Mating Alignment: | With |
Mating Alignment Type: | Polarization |
GPL Description: | Data and Devices |
Connector and Contact Terminate To: | Printed Circuit Board |
Product Code: | D021 |
Number of Signal Positions: | 30 |
Contact Layout: | Matrix |
Connector System: | Board to Board |
Stackable: | No |
ECCN: | EAR99 |
Dielectric Withstanding Voltage: | 1000 V AC |
Board to Board Configuration: | Vertical |
Connector Contact Load Condition: | Fully Loaded |
Contact Mating Area Plating Finish: | Matte |
PCB Mount Alignment: | Without |
Termination Post Tail Length: | .126 in, 3.2 mm |
Connector Assembly Type: | PCB Mount Receptacle |
PCB Contact Termination Area Plating Thickness: | 23.622 µin, .6 µm |
Material Flammability Standard: | UL 94V-0 |
Part Aliases: | 5223668-1 |
SKU: | AMP5223668-1 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |