5223986-2
UPM KEYED GUIDE MODULE
Enhance the stability and precision of your Z-PACK 2mm HM connections with our UPM Keyed Guide Module. Crafted from durable zinc alloy die casting with a protective chromate conversion coating, this module ensures a secure fit at a right angle orientation. Designed for seamless integration, it features a mating alignment with a 45° keyed position, guaranteeing proper alignment with compatible interfaces. With a compact overall length of 34.2mm, it offers essential support for your PCB connectors, making it an indispensable accessory for data and device applications. Compliant with RoHS standards, this guide module is not only reliable but also environmentally friendly. Upgrade your backplane connector setup with this essential hardware component, packaged for convenience in a box.
| Product Category: | |
|---|---|
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | 5223986-2 |
| Series: | Z-PACK 2mm HM |
| Accessory Type: | Guide Module |
| Overall Length: | 34.2 mm |
| Finish/Coating: | Chromate Conversion Coating |
| Mount Angle: | Right Angle |
| Package Quantity: | 1 |
| Base Material: | Zinc Alloy Die Casting |
| GPL: | A87 |
| Packaging: | Box |
| Contact Mating Area Plating: | Zinc Alloy |
| Mating Alignment: | With |
| Mating Alignment Type: | Keyed |
| GPL Description: | Data and Devices |
| Product Code: | 3083 |
| ECCN: | EAR99 |
| Keying and Polarized Position Locations: | 45° |
| Hardware Type: | Guide Socket Module |
| Length: | 34.2 mm |
| Guide Hardware: | With |
| Compatible Interface Type: | 2mm HM |
| Part Aliases: | 5223986-2 |
| SKU: | AMP5223986-2 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 07/03/2020 | P-20-018872 - Product improvement. TE Connectivity plan to develop new tooling for the following Part Numbers and some package specification improvement. There will be no product function change and package quantity change. |
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