5227161-7

RTANG JACK W/MTG PINS, BNC PCB

Easily connect RF cables to PCBs with this right-angle BNC jack featuring secure through-hole solder termination. Designed for optimal performance, it offers impedance of 50 Ω and operates at frequencies up to 4 GHz. The gold-plated phosphor bronze contacts ensure reliable signal transmission, while the zinc body with nickel plating provides durability. With a mating type of bayonet, it guarantees a secure connection. Suitable for commercial use, this connector is RoHS compliant and ideal for various applications in the electronics industry. Its compact design, featuring white housing and a panel mount orientation with lockwasher and nut, makes it easy to integrate into systems. The included mounting posts and detent feature further enhance stability. Trusted for its quality and performance, this BNC jack is a reliable choice for your connectivity needs.
Availability
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL:800.400.7041
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5227161-7
Series:Alcoswitch MTG,OEG Miniature Relay PCF
Gender:Jack
Mount Type:Panel
Termination Method:Through Hole - Solder
Contact Material:Phosphor Bronze
Contact Plating:Gold
Body Orientation:Right Angle
Mating Type:Bayonet
Impedance:50 Ω
Operating Frequency:4 GHz
RF Connector Type:BNC
Body Material:Zinc
Package Quantity:35
Number of Positions:1
Housing Color:White
Mount Orientation:Right Angle
Interface:BNC
GPL:076
Port Configuration:Single Port
Tail Length:.162 in, 4.11 mm
Operating Temperature Range:-55 - 85 °C, -67 - 185 °F
Panel Mount:Rear Mount
PCB Retention:With
Panel Mount Type:Lockwasher and Nut
Sealable:No
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:3133
Number of Coaxial Contacts:1
Mounting Post Length:.137 in, 3.48 mm
Body Insulation:Without
Body Plating Material:Nickel
Center Contact Plating Material:Gold
Center Contact Material:Phosphor Bronze
Center Contact Plating Thickness:30 µin
Detent:With
Dielectric Material:Polymethylpentene
Height Above PC Board:13.18 mm, .519 in
Contact Captivation Method:Solder
Mated Outer Diameter (Approximate):14.529 mm, .572 in
EMI and RFI Protection Type:PCB Ground
Product Grade:Commercial
Connector System:Cable to Board
Panel Attachment Style:Rear Mount
Part Aliases:5227161-7
SKU:AMP5227161-7

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
10/01/2021P-21-020808 - Manufacturing Location Change. The Data and Devices business unit of TE Connectivity ( TE ) is moving its current manufacturing site in Hermosillo, MX to a new manufacturing site in the same city of Hermosillo, MX. The new site is only approximately 3.5 mi (equivalent to approximately 5 km) away from the current site. We plan to migrate all the existing manufacturing equipment relating to the products listed below from our current site to the new site.
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