Elevate your signal transmission with the Z-PACK Future Bus+ series Board-to-Board Connector. Featuring a 4-row design with 24 positions, this connector ensures seamless connectivity in your PCB applications. The durable LCP housing and gold-plated phosphor bronze contacts guarantee reliable performance, even in demanding environments. With a 2mm pitch and 3A amperage, it meets high-speed signal requirements with ease. Designed for vertical mounting on PCBs, it offers efficient signal routing. UL 94V-0 rated for safety, it operates flawlessly in a wide temperature range. Trust in its quality for your data and device connectivity needs. RoHS compliant for environmental responsibility. Upgrade your PCB connections with this advanced connector solution.
P-21-021386 - Manufacturing location change. Following Part Numbers will be transferred from Dengke Branch, Qingdao to TE AMP Qingdao Ltd. High-tech Zone Branch
