5536649-1
2MM FB,ASY,010,PWR,REC,EN,SEQ
Part Aliases: TE Connectivity PER-5536649-1,C04157-000
Experience seamless power connectivity with our Z-PACK Future Bus+ connector. Featuring a durable LCP (Liquid Crystal Polymer) housing in a natural color, this board mount connector ensures reliable performance in a variety of applications. With five rows and through-hole termination methods including solder and press-fit, installation is a breeze. The phosphor bronze contacts, with gold plating, offer excellent conductivity and signal integrity. UL 94V-0 rated for safety, this connector is suitable for power applications with a voltage rating of 30V AC/DC. With a contact layout in a matrix configuration, it's perfect for board-to-board connections. Operating in a wide temperature range of -55 to 125°C (-67 to 257°F), this connector is built to withstand harsh environments. RoHS compliant and ECCN EAR99, it meets international standards for environmental responsibility and export control. Elevate your power connectivity with this high-quality connector assembly.
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5536649-1 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 5 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit, Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC, 30 V DC |
| Contact Type: | Socket |
| USOC Codes: | Futurebus+ |
| Row Spacing: | .079 in, 2 mm |
| Contact Amperage: | 3 A, 5 A |
| Number of Positions: | 10 |
| Housing Color: | Natural |
| Mount Orientation: | Right Angle |
| Operating Temperature Range: | -55 - 125 °C, -67 - 257 °F |
| Circuit Application: | Power |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
| PCB Retention: | With |
| Contact Termination Plating Thickness: | 1.27 µm, 50 µin |
| Connector Height: | 13.3 mm, .523 in |
| PCB Retention Type: | Solder Peg |
| Sealable: | No |
| Mating Alignment Type: | Polarizing Rib |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Number of Power Positions: | 10 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Contact Termination Plating: | Tin |
| Connector Product Type: | Connector Assembly |
| Board to Board Configuration: | Right Angle |
| Termination Post Tail Length: | .14 in, 3.56 mm |
| Contact Retention: | With |
| Glow Wire Rating: | Standard Part - Not Glow Wire |
| Connector and Housing Type: | Receptacle |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | PER-5536649-1,C04157-000 5536649-1 |
| SKU: | AMP5536649-1 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |