5747844-3
09 MSFL RCPT RA 318 (IN,FM,BL)
Enhance connectivity in your electronic projects with this high-quality D-Sub Receptacle. Designed for durability and performance, it features UL 94V-0 compliance for added safety. With a housing material of thermoplastic and gold flash contact plating, it ensures reliable signal transmission. This 9-contact, 2-row connector is ideal for board mount applications, with a pitch of 2.74mm for easy installation. The phosphor bronze contacts provide excellent conductivity, while the threaded insert mating retention type offers secure connections. Its front metal shell construction adds durability, making it a dependable choice for a wide range of applications. Rest assured, it is RoHS compliant, meeting environmental standards. Upgrade your connectivity solutions with this versatile D-Sub Receptacle.
| Product Category: | |
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| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | 5747844-3 |
| Amperage: | 6 A |
| Gender: | Receptacle |
| Housing Material: | Thermoplastic |
| Number of Contacts: | 9 |
| Number of Rows: | 2 |
| Mount Type: | Board Mount |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold Flash |
| Pitch: | 2.74 mm |
| Number of Positions: | 9 |
| Profile: | Standard |
| Mating Retention Type: | Threaded Insert |
| Shell Type: | Front Metal Shell |
| Standards Met: | UL 94V-0 |
| SKU: | AMP5747844-3 |
| Shell Plating Material: | Tin |
| Post Size: | .026 in / .66 mm |
| Eyelet Plating Material: | Tin |
| Eyelet Material: | Brass |
| Shell Material: | Steel |
| Insert Material: | Zinc |
| Plastic: | No |
| Preloaded: | Yes |
| PCB Mount Orientation: | Right Angle |
| PCB Contact Termination Area Plating Material: | Tin |
| Contact Base Material: | Phosphor Bronze |
| Contact Shape and Form: | Round |
| PCB Thickness (Recommended): | 1.58 mm / .062 in |
| Centerline (Pitch): | 2.74 mm / .108 in |
| Housing Material: | Thermoplastic |
| Housing Color: | Black |
| UL Flammability Rating: | UL 94V-0 |
| Threaded Insert Material: | Zinc |
| Threaded Insert Plating Material: | Clear Chromate |
| Mating Connector Lock: | With |
| Panel Mount Feature: | Without |
| Mating Retention: | With |
| Montageausrichtung der Leiterplatte: | With |
| PCB Mount Alignment: | With |
| Mounting Hole Diameter: | .125 in / 3.18 mm |
| Boardlock Plating Material: | Tin |
| Mating Connector Lock Type: | Threaded Insert, 4-40 UNC |
| Connector Mounting Type: | Board Mount |
| PCB Mount Retention Type: | Boardlock |
| PCB Mount Retention: | With |
| PCB Mounting Style: | Through Hole |
| Boardlock Material: | Copper Alloy |
| Circuit Application: | Signal |
| Footprint: | .318 in / 8.08 mm |
| Connector System: | Board-to-Board |
| Sealable: | No |
| Grounding Indents: | Without |
| Shell Size: | 1 |
| Row-to-Row Spacing: | .112 in / 2.84 mm |
| Connector and Contact Terminates To: | Printed Circuit Board |
| Grounded: | No |
| Grounding Straps: | With |
| Product Type: | Connector |
| Termination Post Length: | 3.18 mm / .125 in |
| Grounding Clips: | Without |
| Operating Temperature Range: | -55 - 105 °C / -67 - 221 °F |
| Supplier Product: | PCB D-Sub Connectors |
| Part Alias: | 1374535,2-42936-9892 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/31/2022 | P-22-023406 - Packaging Change. Improved packaging method and quality of package. © 2020 TE Connectivity. Confidential & Proprietary. Do not reproduce or distribute externally including non-authorized representatives and distributors. Create a sustainable future by limiting print copies, and recycling paper. Proposed package Improved packaging method does not require manual force to secure the tray with a new semi-automatic process. The main objective is to improve the quality of the package. |
Download |
| 10/01/2021 | P-21-020809 - Manufacturing Location Change. The Data and Devices business unit of TE Connectivity ( TE ) is moving its current manufacturing site in Hermosillo, MX to a new manufacturing site in the same city of Hermosillo, MX. The new site is only approximately 3.5 mi (equivalent to approximately 5 km) away from the current site. We plan to migrate all the existing manufacturing equipment relating to the products listed below from our current site to the new site. | Download |
| 10/30/2017 | P-17-014029 - Manufacturing Location Change. TE Connectivity (TE) is moving manufacturing location of the products listed below from TE Hermosillo to TE Guangdong. Please contact your TE Sales Engineer with questions. | Download |
| 04/01/2013 | Project Lantern PTP Migration Parts - MNF. location change from NC. | Download |