5747846-6
25 MSFL RCPT RA 318 (SL,FM,BL)
Elevate your connectivity with the AMPLIMITE HD-20 series D-Sub Receptacle. Designed for high performance, this connector features UL 94V-0 compliance for enhanced safety. With 25 gold-plated contacts on a dual-row configuration, it ensures reliable data transmission. The thermoplastic housing and front metal shell guarantee durability, while the screw mating retention type offers secure assembly. Perfect for board mount applications, this D-Sub connector with a 2.77 mm pitch is RoHS compliant, meeting environmental standards. Upgrade your connections with this premium component.
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5747846-6 |
| Series: | AMPLIMITE HD-20 |
| Amperage: | 6 A |
| Gender: | Receptacle |
| Housing Material: | Thermoplastic |
| Number of Contacts: | 25 |
| Number of Rows: | 2 |
| Mount Type: | Board Mount |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Pitch: | 2.77 mm |
| Number of Positions: | 25 |
| Profile: | Standard |
| Mating Retention Type: | Screw |
| Shell Type: | Front Metal Shell |
| Standards Met: | UL 94V-0 |
| SKU: | AMP5747846-6 |
| Shell Plating Material: | Tin |
| Post Size: | .026 in / .66 mm |
| Female Screwlock Material: | Zinc |
| Female Screwlock Plating Material: | Clear Chromate |
| Plastic: | No |
| Eyelet Plating Material: | Tin |
| Shell Material: | Carbon Steel |
| Insert Material: | Zinc |
| Eyelet Material: | Brass |
| Preloaded: | Yes |
| PCB Mount Orientation: | Right Angle |
| PCB Contact Termination Area Plating Material: | Tin |
| Contact Mating Area Plating Thickness: | 30 µin |
| Contact Base Material: | Phosphor Bronze |
| Contact Shape and Form: | Round |
| PCB Thickness (Recommended): | 1.57 mm / .062 in |
| Housing Color: | Black |
| Housing Material: | Thermoplastic |
| Centerline (Pitch): | .109 in / 2.77 mm |
| UL Flammability Rating: | UL 94V-0 |
| Boardlock Material: | Brass |
| Boardlock Plating Material: | Tin over Nickel |
| Mating Retention: | With |
| Panel Mount Feature: | Without |
| Mating Connector Lock: | With |
| Mounting Hole Diameter: | .125 in / 3.18 mm |
| PCB Mount Retention: | With |
| PCB Mounting Style: | Through Hole |
| Connector Mounting Type: | Board Mount |
| PCB Mount Retention Type: | Boardlock |
| Mating Connector Lock Type: | Female Screwlocks, Fixed |
| PCB Mount Alignment: | With |
| Montageausrichtung der Leiterplatte: | With |
| Circuit Application: | Signal |
| Footprint: | .318 in / 8.08 mm |
| Shell Size: | 3 |
| Connector System: | Board-to-Board |
| Sealable: | No |
| Grounding Indents: | Without |
| Row-to-Row Spacing: | .112 in / 2.84 mm |
| Connector and Contact Terminates To: | Printed Circuit Board |
| Grounded: | No |
| Grounding Straps: | With |
| Product Type: | Connector |
| Termination Post Length: | 3.18 mm / .125 in |
| Grounding Clips: | Without |
| Operating Temperature Range: | -55 - 105 °C / -67 - 221 °F |
| Supplier Product: | PCB D-Sub Connectors |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/31/2022 | P-22-023406 - Packaging Change. Improved packaging method and quality of package. © 2020 TE Connectivity. Confidential & Proprietary. Do not reproduce or distribute externally including non-authorized representatives and distributors. Create a sustainable future by limiting print copies, and recycling paper. Proposed package Improved packaging method does not require manual force to secure the tray with a new semi-automatic process. The main objective is to improve the quality of the package. | Download |
| 10/01/2021 | P-21-020809 - Manufacturing Location Change. The Data and Devices business unit of TE Connectivity ( TE ) is moving its current manufacturing site in Hermosillo, MX to a new manufacturing site in the same city of Hermosillo, MX. The new site is only approximately 3.5 mi (equivalent to approximately 5 km) away from the current site. We plan to migrate all the existing manufacturing equipment relating to the products listed below from our current site to the new site. | Download |
| 10/30/2017 | P-17-014029 - Manufacturing Location Change. TE Connectivity (TE) is moving manufacturing location of the products listed below from TE Hermosillo to TE Guangdong. Please contact your TE Sales Engineer with questions. | Download |