Introducing a high-performance MICT assembly for board-to-board connections, featuring 190 inline contact positions with a .025-inch pitch. With CSA and UL certifications, this assembly guarantees quality and safety, meeting stringent flammability standards with a housing made of LCP. Designed for signal applications, it offers a data rate of 10 Gb/s and impedance of 50 Ω, ensuring reliable performance. The surface-mount termination method and gold or palladium nickel plating on the contact mating area facilitate efficient connectivity. Operating in a wide temperature range from -67 to 257 °F, this assembly is suitable for diverse environments. Its compact vertical mount orientation and board-to-board configuration with mezzanine stacking make it ideal for space-constrained applications. The dual-beam contact shape, with 11.5 A contact amperage, guarantees robust and stable connections. With features like differential signaling support and 30 V AC/5 V DC voltage rating, this MICT assembly is a versatile and dependable solution for demanding electronic systems.
