| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | Amphenol FCI Berg |
| Manufacturer Part Number: | Amphenol FCI Berg 61083-124602LF |
| Color: | Natural |
| Pitch: | 0.8 mm |
| Gender: | Male |
| Mount Angle: | Straight |
| Mating Cycles: | 100 cycle |
| Current Rating: | 0.8 A |
| Number of Rows: | 2 |
| Voltage Rating: | 100 VAC |
| Contact Plating: | Gold Over Palladium-Nickel |
| Contact Material: | Brass |
| Housing Material: | Glass-Filled Liquid Crystal Polymer |
| Number of Contacts: | 120 |
| Flammability Rating: | UL 94V-0 |
| Maximum Operating Temperature: | 125 °C |
| Minimum Operating Temperature: | -40 °C |
| Series: | BergStak® |
| SKU: | BRG61083-124602LF |
61083-124602LF
| Heilind Number: | BRG61083-124602LF |
| Manufacturer: | Amphenol FCI Berg |
| Manufacturer Number: | 61083-124602LF |
| ECAD Model: |
Specifications
Detailed Description
Introducing the BERG61083-124602LF, a high-performance BergStak® board-to-board connector designed for male connectors in electronic applications. Featuring a natural color housing made of glass-filled liquid crystal polymer, this connector ensures durability and reliability in extreme operating conditions. With 120 gold-plated brass contacts arranged in 2 rows at a pitch of 0.8mm, it offers excellent signal transmission and conductivity. Rated for a maximum operating temperature of 125°C and a minimum of -40°C, it guarantees performance in a wide range of environments. With a current rating of 0.8A and a voltage rating of 100VAC, it is suitable for various power and signal applications. RoHS compliant and UL 94V-0 rated for flammability, it meets the highest industry standards for safety and environmental responsibility. Perfect for use in mezzanine and board stacking configurations, the BERG61083-124602LF is the ideal connector for your PCB connectivity needs.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 04/15/2016 | PCN16002 - Packaging Change. 1. Change the existing material of carrier tape from Polystyrene clear (PS) to Polythylene terephthalate clear (PET). 2. Change existing carrier tape design to prevent deformation of solder tail of terminals. | Download | |||

