171395-1807
Impel 92 Ohm, 6 Pair Vertical Backplane Header, 1.90mm Pitch, Unguided, Open Endwalls, 8 Columns, 96 Circuits, Pin Length 4.90mm, Plated Through Hole Dimension 0.36mm
Part Aliases: Molex 1713951807
Enhance your backplane connections with the Impel 92 Ohm, 6 Pair Vertical Backplane Header. Featuring a 1.90mm pitch and unguided design, this header boasts 96 circuits spread across 8 columns for efficient connectivity. With a pin length of 4.90mm and plated through hole dimensions of 0.36mm, it ensures secure and reliable performance. Crafted from high-performance alloy with gold plating, it guarantees high conductivity and durability. Its full shield and high-temperature thermoplastic construction make it suitable for demanding environments. Operating within a wide temperature range of -55 to 85 °C, and with a voltage rating of 150 V AC/DC, it offers versatility for various applications. With a data rate of 40 Gb/s and 92 Ω impedance, this header is designed for high-speed and high-frequency transmission. RoHS compliant and packaged in a tray, it meets industry standards for environmental responsibility and convenient handling. Upgrade your PCB connections with this advanced backplane connector, perfect for demanding industrial and commercial settings.
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 171395-1807 |
Color: | Black |
Series: | 171395 - Impel |
Amperage: | .75 A |
Connector Type: | Impel |
Number of Contacts: | 96 |
Number of Rows: | 12 |
Contact Material: | High Performance Alloy (HPA) |
Contact Plating: | Gold |
Maximum Operating Temperature: | 85 °C |
Minimum Operating Temperature: | -55 °C |
Pitch: | 1.9 mm |
Voltage: | 150 V AC/DC |
Shield Type: | Full Shield |
Material: | High Temperature Thermoplastic |
Orientation: | Vertical |
Impedance: | 92 Ω |
Keying: | No |
Component Type: | PCB Header |
Number of Pairs: | 6-pair |
Data Rate: | 40 Gb/s |
Tail Length: | 1.3 mm |
Packaging: | Tray |
Operating Temperature Range: | -55 - 85 °C |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | .762 µm |
Number of Contacts Loaded: | 96 |
Mating Cycles: | 200 |
PCB Locator: | No |
PCB Retention: | Without |
PCB Thickness (Recommended): | 1 mm |
Number of Columns: | 8 |
Contact Termination Plating: | Nickel, Tin |
Termination Pitch: | 1.9 mm |
Guide to Mating Part: | No |
Board to Board Configuration: | Backplane |
Make First / Break Last: | No |
Part Aliases: | 1713951807 |
SKU: | MOL171395-1807 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
---|---|---|
09/11/2022 | 512356 - Capacity change or tool replacement. This notification is to inform you about set of tooling is being added to meet the current and future demands of this product referenced below. There will be no changes in fit, form or function from additional tooling when compared to the existing tooling | Download |
11/30/2015 | GCM 10727338 - New, Modified, Or Replacement Tooling. Molex is adding capacity to the Impel line for both Headers and DC modules. Product produced after Nov 2015 might contain parts produced from the added capacity. Molex had qualified the product produced from the added capacity prior shipment. | Download |