172050-3064

EdgeLine+ ESP Vertical Connector, 15 Gbps, 0.75mm Pitch, 1.57mm PCB Thickness, 40.0A Power Module, 64 Circuits, 2 Power Circuits

Part Aliases: Molex 1720503064  
Experience high-speed connectivity with our EdgeLine+ ESP Vertical Connector. Offering a blazing 15 Gbps data rate, this connector boasts a slim 0.75mm pitch and is designed for 1.57mm PCB thickness. With a robust 40.0A power module and 64 circuits (including 2 power circuits), it ensures efficient power delivery. Crafted from durable thermoplastic with gold-plated copper alloy contacts, it guarantees reliable performance. Meeting general standards, it is suitable for a wide range of applications. Its straight orientation, surface mount termination, and vertical design make it easy to integrate into your PCB assembly. RoHS compliant and featuring UL and CSA agency certifications, this connector is a high-quality solution for your connectivity needs.
Availability
Immediate Shipment: NA
Stock Location: In Stock
Factory Stock: Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple: 1/1
Pricing
CALL: 800.400.7041
Product Category:
Manufacturer: Molex
Manufacturer Part Number: Molex 172050-3064
Color: Black
Series: 172050 - EdgeLine
Amperage: 1.5 A, 40 A
Connector Type: EdgeLine
Housing Material: Thermoplastic
Number of Contacts: 64
Termination Method: Surface Mount
Contact Material: Copper Alloy
Contact Plating: Gold over Nickel
Body Orientation: Straight
Pitch: .75 mm
Voltage: 250 V AC/DC
Material: High Temperature Thermoplastic
Orientation: Vertical
Component Type: Edgecard to PCB
Data Rate: 12.5 - 20 Gb/s
Packaging: Tube
Operating Temperature Range: -40 - 105 °C
Contact Mating Area Plating: Gold over Nickel
Contact Mating Area Plating Thickness: .762 µm
Number of Contacts Loaded: 64
Mating Cycles: 200
PCB Locator: Yes
PCB Retention: Yes
Contact Termination Plating Thickness: .762 µm
Polarized to Mate: Yes
PCB Thickness (Recommended): 2.79 mm
CSA Agency Certification: LR19980
UL Agency Certification: E29179
Contact Termination Plating: Tin
Maximum Solder Process Temperature: 260 °C
Lead Free Process Capability: REFLOW
Duration at Max. Process Temperature (seconds): 010
Max. Cycles at Max. Process Temperature: 002
Termination Pitch: .75 mm
Power and Signal Configuration: 64 s - 0 p
Edge Card Thickness: 1.57 mm
Standards Met: General
Part Aliases: 1720503064
SKU: MOL172050-3064

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes:

Product Change Notice

Effective Date Description of Change Download
12/26/2022 512555 - Change supplier. Current Vendor Kemper Stopped producing C42500 metal alloy we must qualify new source Boway to keep Production running metal alloys are not changed Boway is one of Local metal supplier in china.
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