172050-3064
EdgeLine+ ESP Vertical Connector, 15 Gbps, 0.75mm Pitch, 1.57mm PCB Thickness, 40.0A Power Module, 64 Circuits, 2 Power Circuits
Part Aliases: Molex 1720503064
Experience high-speed connectivity with our EdgeLine+ ESP Vertical Connector. Offering a blazing 15 Gbps data rate, this connector boasts a slim 0.75mm pitch and is designed for 1.57mm PCB thickness. With a robust 40.0A power module and 64 circuits (including 2 power circuits), it ensures efficient power delivery. Crafted from durable thermoplastic with gold-plated copper alloy contacts, it guarantees reliable performance. Meeting general standards, it is suitable for a wide range of applications. Its straight orientation, surface mount termination, and vertical design make it easy to integrate into your PCB assembly. RoHS compliant and featuring UL and CSA agency certifications, this connector is a high-quality solution for your connectivity needs.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 172050-3064 |
| Color: | Black |
| Series: | 172050 - EdgeLine |
| Amperage: | 1.5 A, 40 A |
| Connector Type: | EdgeLine |
| Housing Material: | Thermoplastic |
| Number of Contacts: | 64 |
| Termination Method: | Surface Mount |
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold over Nickel |
| Body Orientation: | Straight |
| Pitch: | .75 mm |
| Voltage: | 250 V AC/DC |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Component Type: | Edgecard to PCB |
| Data Rate: | 12.5 - 20 Gb/s |
| Packaging: | Tube |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Gold over Nickel |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 64 |
| Mating Cycles: | 200 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Contact Termination Plating Thickness: | .762 µm |
| Polarized to Mate: | Yes |
| PCB Thickness (Recommended): | 2.79 mm |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 010 |
| Max. Cycles at Max. Process Temperature: | 002 |
| Termination Pitch: | .75 mm |
| Power and Signal Configuration: | 64 s - 0 p |
| Edge Card Thickness: | 1.57 mm |
| Standards Met: | General |
| Part Aliases: | 1720503064 |
| SKU: | MOL172050-3064 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/26/2022 | 512555 - Change supplier. Current Vendor Kemper Stopped producing C42500 metal alloy we must qualify new source Boway to keep Production running metal alloys are not changed Boway is one of Local metal supplier in china. | Product Change Notice Download |