26-61-4040

KK 396 Header, Vertical, Friction Lock, 4 Circuits, Gold (Au) Plating

Part Aliases: Molex 0026614040   Molex 41791-0021  
Easily connect wires on your PCB with this vertical KK 396 Header. Featuring a friction lock design for secure attachment, it offers 4 gold-plated circuits for efficient conductivity. With a straight body orientation and through-hole termination method, it ensures a reliable connection. Meeting UL and CSA standards, it guarantees safety and quality. Its compact 3.96mm pitch and 1.6mm PCB thickness make it ideal for various electronic applications. RoHS compliant and lead-free process capable, it's a sustainable choice for your projects.
Availability
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL:800.400.7041
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 26-61-4040
Color:Natural
Series:41791 - KK 396
Amperage:7 A
Connector Type:KK 396
Number of Contacts:4
Number of Rows:1
Termination Method:Through Hole
Contact Material:Brass
Body Orientation:Straight
Pitch:3.96 mm
Voltage:250 V
Material:Polyester
Orientation:Vertical
Tail Length:3.56 mm
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.508 µm
Number of Contacts Loaded:4
Mating Cycles:50
PCB Locator:No
PCB Retention:Without
Polarized to PCB:No
Contact Termination Plating Thickness:.508 µm
Polarized to Mate:Yes
PCB Thickness (Recommended):1.6 mm
Connector System:Wire to Board
Contact Termination Plating:Matte Tin
Maximum Solder Process Temperature:235 °C
Lead Free Process Capability:WAVE
Duration at Max. Process Temperature (seconds):005
Max. Cycles at Max. Process Temperature:001
Glow Wire Capable:No
Lock to Mating Part:Yes
Stackable:Yes
Breakaway:No
Shroud Type:Partial
Material Flammability Standard:94V-0
Part Aliases:0026614040 41791-0021
SKU:MOL26-61-4040

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
12/31/2022512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as
per attached list. No changes will be made to product as part of this change
Download
02/28/2022511543 - Packaging Method/Quantity Changing. proposed packaging method is bulk packaging with air inflated bags there will be a change in DU & MLQ qty
this packaging change is done to improve the packaging quality and to effectively protect the products during transit. new packaging concept was validated with drop test at 80cm drop height there are no product/process change for the listed parts.
Download
11/12/2021510732 - Capacity change or tool replacement. new capacity mold and assembly machine is getting added. wafers will be supplied from any of 1 existing mold or 1 new mold after the implementation date. headers will be supplied from any 4 existing machines or 1 new machine after the implementation date.
Download
03/01/2021509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function)Download
03/15/2019506854 - Packaging Method/Quantity Changing. This letter is to inform you that the part(s) referenced in this
notice will undergo packaging specification changes that may include new container sizes, quantities or changes to the label.
Download
07/01/2017502658 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move.Download