| Effective Date |
Description of Change
| Download |
| 12/24/2022 |
512047 - Equipment Transfer, Production Transfer or Rearrangement. This notification is to inform you about an equipment transfer that has been used to manufacture impacted part(s). Equipment has been moved to different site/ location/ premises. No changes will be made to product as part of this change. |
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| 08/17/2022 |
512449 - Retraction of PCN 510937. retraction is due to the project not moving forward at this time, the compounding location for SPS/PA66 grade material will not be moving from the current sub-supplier. if it is deemed that this project will again move forward at a later date a new PCN will be created & sent to impacted customers.
|
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| 07/29/2022 |
510937 - Change Supplier. in efforts to mitigate the supply risk of resin material our current supplier for SPS/PA66 grade of material will be transitioning to a new Sub-Supplier fir compounding. |
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| 07/12/2022 |
512278 - Retraction of PCN 510384. Due to global material constraints & delays on getting this material to move.
|
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| 08/16/2021 |
510384 - Supplier Change. Due to mfg constraints at the Florence Kentucky Location of one of our resin suppliers it has been determined to move the Mfg of one of the resin product families to Evansville Indiana location of that same supplier. |
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| 12/18/2015 |
GCM 10723266 - New, Modified, Or Replacement Tooling. |
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| 08/01/2014 |
GCM 10627818 - Supplier Change. |
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| 05/22/2014 |
GCM 10632645 - New, Modified, Or Replacement Tooling. Molex is creating two new molds to increase our capacity to make HDAC assemblies at our Lincoln NE location. One mold will make 30700 24 circuit
housings and the other mold will make 30968 24 circuit housings. |
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