39-29-1247
Mini-Fit Jr. Header, Dual Row, Right Angle, with PCB Mounting Flange, 24 Circuits, PA Polyamide Nylon 6/6 94V-0, Tin (Sn) Plating
Enhance your PCB connectivity with our Mini-Fit Jr. Header, a versatile component designed for optimal performance. Featuring a dual-row configuration with right-angle orientation and a convenient PCB mounting flange, this header offers seamless integration into your electronic assemblies. With 24 circuits and a durable construction of PA Polyamide Nylon 6/6 94V-0, it ensures reliable connections in demanding environments. The Tin (Sn) plating provides excellent conductivity, while the 4.2mm pitch and 600V voltage rating cater to various application requirements. Certified for UL and CSA standards, this connector guarantees safety and quality. Its through-hole termination method, brass contacts, and high-temperature operation range make it suitable for a wide range of industrial applications. Trust in the Mini-Fit Jr. Header for efficient and secure wire-to-board connections.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 39-29-1247 |
| Color: | Natural |
| Series: | 5569 - Mini-Fit Jr. |
| Amperage: | 13 A |
| Connector Type: | Mini-Fit Jr. |
| Number of Contacts: | 24 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole |
| Contact Material: | Brass |
| Body Orientation: | Right Angle |
| Pitch: | 4.2 mm |
| Voltage: | 600 V |
| Material: | Nylon |
| Orientation: | Right Angle |
| Keying: | No |
| Packaging: | Bag |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Matte Tin |
| Contact Mating Area Plating Thickness: | 2.54 µm |
| Number of Contacts Loaded: | 24 |
| Mating Cycles: | 30 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| Polarized to Mate: | Yes |
| PCB Thickness (Recommended): | 1.78 mm |
| Connector System: | Wire to Board |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Matte Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | WAVE |
| Duration at Max. Process Temperature (seconds): | 005 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Termination Pitch: | 4.2 mm |
| Glow Wire Capable: | No |
| Guide to Mating Part: | No |
| Lock to Mating Part: | Yes |
| Stackable: | No |
| Surface Mount Compatible: | No |
| Breakaway: | No |
| Make First / Break Last: | No |
| Shroud Type: | Fully |
| Product Name: | Mini-Fit Jr. |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0039291247;5569-24A1-210 |
| SKU: | MOL39-29-1247 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/31/2022 | 512847 - Change Supplier. This notification is to inform you about addition of new Supplier or Sub Supplier impacting the part(s) as per attached list. No changes will be made to product as part of this change |
Download |
| 03/01/2021 | 509366 - Manufacturing Process Change. molex India is introducing new plating lines at the new connector facility with lates technology in line with other Molex entities and reduce the process related challenges in current lines. to facilitate the plating technology change we are changing the gold and silver chemistry. (no change to form, fit or function) | Download |
| 08/28/2020 | 508706 - Packaging Method/Quantity Changing. The DU min, MLQ Min, MDQ min Quantity change. The change only apply in sales view for Nogales plant. | Download |
| 07/01/2017 | 502703 - Equipment Transfer, Production Transfer or Rearrangement. | Download |