43650-0612
Micro-Fit 3.0 Right-Angle Header, 3.00mm Pitch, Single Row, 6 Circuits, with Solder Tab, Tin, Glow-Wire Capable, Black
Part Aliases: Molex 0436500612
Enhance your PCB connections with the Micro-Fit 3.0 Right Angle Header. Featuring a 3.00mm pitch and a single row design with 6 circuits, this header is ideal for space-saving applications. Its solder tab termination method ensures secure attachment, while its tin plating and glow wire capability guarantee reliable performance. Crafted from high temperature thermoplastic, it can withstand harsh operating conditions ranging from -40 to 105 °C. With a current rating of 8.5 A and a voltage of 600 V, it offers efficient power transmission. The right angle orientation and PCB locator ensure easy assembly, while its RoHS compliance underscores its environmental responsibility. Ideal for wire-to-board connections, this header is a versatile and durable solution for your connectivity needs.
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 43650-0612 |
Color: | Black |
Series: | 43650 |
Amperage: | 8.5 A |
Connector Type: | Micro-Fit 3.0 |
Number of Contacts: | 6 |
Number of Rows: | 1 |
Termination Method: | Surface Mount |
Contact Material: | Brass |
Body Orientation: | Right Angle |
Pitch: | 3 mm |
Voltage: | 600 V |
Material: | High Temperature Thermoplastic |
Orientation: | Right Angle |
Operating Temperature Range: | -40 - 105 °C |
Contact Mating Area Plating: | Tin |
Contact Mating Area Plating Thickness: | 2.54 µm |
Number of Contacts Loaded: | 6 |
Mating Cycles: | 30 |
PCB Locator: | Yes |
PCB Retention: | Yes |
Polarized to PCB: | Yes |
Contact Termination Plating Thickness: | 2.540 µm |
PCB Thickness (Recommended): | 1.6 mm |
Connector System: | Wire to Board |
Contact Termination Plating: | Tin |
Maximum Solder Process Temperature: | 260 °C |
Lead Free Process Capability: | REFLOW |
Duration at Max. Process Temperature (seconds): | 030 |
Max. Cycles at Max. Process Temperature: | 003 |
Glow Wire Capable: | Yes |
Mated Height: | 6.98 mm |
Stackable: | No |
Breakaway: | No |
Shroud Type: | Fully |
Product Name: | Micro-Fit 3.0 |
Material Flammability Standard: | 94V-0 |
Part Aliases: | 0436500612 |
SKU: | MOL43650-0612 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
---|---|
Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
---|---|---|
11/22/2024 | 515106 - Equipment transfer, production transfer rearrangement. Move the tooling molds from Lincoln to Nogales. | Download |
03/31/2023 | 513478 - Retraction of PCN 512489. This notification is to advise you of a Cancellation to a previously issued PCN. the previous issued PCN 512489 will not be implemented due to disagreement by impacted customers. | Download |
10/10/2022 | 512489 - Change Supplier.This notification is to inform you about change of supplier impacting the part(s) attached as per list, No changes will be made to product as part of this change change LCP resin supplier but the resin LCP black is not changed before: Celanese LCP After: Kingfa LCP | Download |
08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download |
06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download |
07/01/2017 | 502635 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. | Download |
05/23/2015 | GCM 10680627 - New, Modified, Or Replacement Tooling. | Download |
05/06/2015 | GCM 10664055 - Manufacturing Process Change. | Download |