| Effective Date | Description of Change | Download |
|---|
| 05/30/2022 | 511687 - Capacity change or tool replacement. This notification is to inform you about set of tooling is being added to meet the current and future demands of this product referenced below. There will be no changes in fit, form or function from additional tooling when compared to the existing tooling | Product Change Notice Download |
| 05/26/2019 | 505745 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change. | Product Change Notice Download |
| 11/01/2017 | 501789 - Manufacturing Process Change Molex and Suppliers. This letter is to inform you that the manufacturing process for the part(s) identified in this notice is changing. No changes will be made to the product as a result of this process change. | Product Change Notice Download |
| 09/01/2016 | GCM 10731024 - Tooling / Equipment Transfer. The purpose of this letter is to inform you that Molex will make transfer the Modjack production line from Molex Lincoln NE to Molex Chengdu ,CN in 3 stages. This Change is to consolidate Modjacks and Magjack manufacturing in the same facility. The impact of the change will be our shield suppliers and housing suppliers will change to China based suppliers, and parts will now be manufactured and assembled in Chengdu. This product move will be implemented in 3 phases , over the course of approximately 7 months, starting April 2016. | Product Change Notice Download |
| 01/04/2016 | GCM 10732378 - Product Component Change. This letter is to inform you that changes are being made to the part(s) identified in this Notice. The change will affect the fit, form, function or the appearance of the parts. | Product Change Notice Download |
| 06/19/2015 | GCM 10662459 - Product Component Change. Molex is sending this letter to announce a minor change to the modjack housing. A small portion of housing is being removed to allow the solder to flow evenly during the reflow soldering process. This change will not affect the circuit board layout or the function of the connector after it is soldered to the circuit board. | Product Change Notice Download |
