45719-0003
12.90mm Pitch EXTreme PowerEdge, Through Hole Solder for 3.18mm Thick PC Board, Mates to a 1.57mm Thick Card Edge or Bus Bar Tab
Enhance power distribution in your electronic systems with our Bus Bar Socket in black. Engineered for extreme performance, this connector features a straight body orientation with an 8-contact configuration for seamless integration. Constructed with high-quality materials including High Performance Alloy (HPA) contacts and gold plating, it ensures reliable conductivity and durability. With a 40A amperage rating and 250V voltage capacity, it meets general standards for efficient power transmission. The through-hole termination method and vertical orientation make installation easy, while the high-temperature thermoplastic housing guarantees stability in various operating environments. RoHS compliant and certified by leading agencies, this connector is a top choice for demanding applications in the PCB connectivity.
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| Manufacturer: | Molex |
| Manufacturer Part Number: | 45719-0003 |
| Color: | Black |
| Series: | 45719 - Bus Bar Socket - EXTreme PowerEdge |
| Amperage: | 40 A |
| Connector Type: | Bus Bar Socket, EXTreme PowerEdge |
| Housing Material: | Thermoplastic |
| Number of Contacts: | 8 |
| Termination Method: | Through Hole |
| Contact Material: | High Performance Alloy (HPA) |
| Contact Plating: | Gold |
| Body Orientation: | Straight |
| Pitch: | 12.9 mm |
| Voltage: | 250 V |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Component Type: | Edgecard to PCB |
| Angle: | Vertical (Top Entry) |
| Tail Length: | 4.5 mm |
| Packaging: | Tray |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 8 |
| Mating Cycles: | 200 |
| Contact Termination Plating Thickness: | 3.81 µm |
| PCB Thickness (Recommended): | 3.2 mm |
| CSA Agency Certification: | LR19980 |
| TUV Agency Certification: | R72090228 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 250 °C |
| Lead Free Process Capability: | WAVE |
| Duration at Max. Process Temperature (seconds): | 005 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Power and Signal Configuration: | 8 p - 0 s |
| Edge Card Thickness: | 1.57 mm |
| Standards Met: | General |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0457190003 |
| SKU: | MOL45719-0003 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
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| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 04/14/2016 | GCM 10722464 - New, Modified, Or Replacement Tooling. The purpose of this letter is to inform you that, in order to improve the quality for all the PowerEdge products, Molex will change the manufacturing location from Lincoln,NE,USA to Chengdu,China. Tooling existed now in Chengdu was qualified and started the production since 2013. | Download |