47553-0001
1.27mm Pitch SIM Card Holder with 2 Detect Pins, 6 Circuits, Push-Push Style, Housing Height 1.80mm, without Pegs, Lead-Free
Introducing our Mini-SIM connector, part of the 47553 series. Designed for reliable performance, it features a thermoplastic housing and copper alloy contacts with gold plating for enhanced conductivity. With a surface mount termination method and six contacts, it ensures secure connectivity in various applications. Operating in a wide temperature range from -40 to 85°C, it offers durability and stability. RoHS compliant and lead-free, it meets international standards for environmental responsibility. Perfect for memory card connectors and other electronic devices, this mini-SIM connector guarantees optimal functionality.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 47553-0001 |
| Series: | 47553 - mini-SIM |
| Amperage: | .5 A |
| Connector Type: | mini-SIM |
| Housing Material: | Thermoplastic |
| Number of Contacts: | 6 |
| Termination Method: | Surface Mount |
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold over Nickel |
| Maximum Operating Temperature: | 85 °C |
| Minimum Operating Temperature: | -40 °C |
| Pitch: | 2.54 mm |
| Voltage: | 50 V DC |
| Material: | High Temperature Thermoplastic |
| Shell Material: | Stainless Steel |
| Packaging: | Embossed Tape on Reel |
| Operating Temperature Range: | -40 - 85 °C |
| Contact Mating Area Plating: | Gold over Nickel |
| Contact Mating Area Plating Thickness: | 2.54 mm |
| Number of Contacts Loaded: | 6 |
| Mating Cycles: | 2500 |
| PCB Locator: | No |
| Shielded: | Yes |
| PCB Retention: | Yes |
| Contact Termination Plating Thickness: | 1.27 mm |
| Contact Termination Plating: | Gold |
| Maximum Solder Process Temperature: | 250 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 010 |
| Max. Cycles at Max. Process Temperature: | 002 |
| Card Detection Switch: | Open |
| Card Entry Location: | Front |
| Part Aliases: | 0475530001 |
| SKU: | MOL47553-0001 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 01/03/2025 | 515293 - Packaging method/qty Changing. This notification is to inform you about part(s) listed will undergo changes for packaging size/ packaging specification change. No changes will be made to product as part of this change. |
Download |
| 04/30/2023 | 513394 - Retraction modification of PCN 512019. this pcn is to make some modifications to the previous pcn 512019 because of resource and strategy adjustment molex decides to suspend alternative material study/qualification on some products during this PCN |
Download |
| 07/14/2022 | 512019 - Change Supplier. This notification is to inform you about changes that are being made to the part(s) as identified in the list. This change is only the raw material supplier and will not affect fit, form or function. | Download |
| 06/30/2016 | GCM 10739344 - Change In Packaging Specifications. The purpose of this letter is to inform you that we will improve the packing method for nylon plastic bag. it includes: for SIM/TF series: Add vacuum packing bag and suggestion label on the bag, and also add desiccant into the bag. for SATA series: change the packing bag to MBB. This change is to prevent the HSG blister risk to improve the quality performance. | Download |
| 06/10/2016 | GCM 10732806 - Change In Test / Inspection Methods. Molex Chengdu plan to do the process change on 47533 series manual assembly line. We will use auto CCD inspection and packaging station to replace current 3 manual stations(Manual CCD inspection 6pin contact height/Gauge check coplanarity/Manual FG packaging machine). All validation is in process and we are expecting to complete the changeover action in the 2016/5/10. This will improve our product's quality performance. | Download |