47553-1001
1.27mm Pitch SIM Card Holder with 2 Detect Pins, 6 Circuits, Push-Push Style, Housing Height 1.80mm, with Pegs, Lead-Free
Part Aliases: Molex 0475531001
Introducing our Mini-SIM Connector, part of the 47553 series. With a compact design and six contacts, it ensures reliable connectivity in various electronic devices. Featuring a surface-mount termination method and gold-plated copper alloy contacts, it offers high performance and durability. The thermoplastic housing and stainless steel shell provide robust construction, suitable for a wide operating temperature range from -40 to 85 °C. RoHS compliant and lead-free process capable, it meets environmental standards. Ideal for memory card applications, this connector guarantees secure and efficient data transfer in your devices.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 47553-1001 |
| Series: | 47553 - mini-SIM |
| Amperage: | .5 A |
| Connector Type: | mini-SIM |
| Housing Material: | Thermoplastic |
| Number of Contacts: | 6 |
| Termination Method: | Surface Mount |
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold over Nickel |
| Maximum Operating Temperature: | 85 °C |
| Minimum Operating Temperature: | -40 °C |
| Pitch: | 2.54 mm |
| Voltage: | 50 VDC |
| Material: | High Temperature Thermoplastic |
| Shell Material: | Stainless Steel |
| Operating Temperature Range: | -40 - 85 °C |
| Contact Mating Area Plating: | Gold over Nickel |
| Contact Mating Area Plating Thickness: | 2.54 mm |
| Number of Contacts Loaded: | 6 |
| Mating Cycles: | 5000 |
| PCB Locator: | Yes |
| Shielded: | Yes |
| PCB Retention: | Yes |
| Contact Termination Plating Thickness: | 1.27 mm |
| Contact Termination Plating: | Gold |
| Maximum Solder Process Temperature: | 250 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 010 |
| Max. Cycles at Max. Process Temperature: | 002 |
| Card Detection Switch: | Open |
| Card Entry Location: | Front |
| Part Aliases: | 0475531001 |
| SKU: | MOL47553-1001 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 01/03/2025 | 515293 - Packaging method/qty Changing. This notification is to inform you about part(s) listed will undergo changes for packaging size/ packaging specification change. No changes will be made to product as part of this change. | Download |
| 06/30/2016 | GCM 10739344 - Change In Packaging Specifications. The purpose of this letter is to inform you that we will improve the packing method for nylon plastic bag. it includes: for SIM/TF series: Add vacuum packing bag and suggestion label on the bag, and also add desiccant into the bag. for SATA series: change the packing bag to MBB. This change is to prevent the HSG blister risk to improve the quality performance. | Download |
| 06/10/2016 | GCM 10732806 - Change In Test / Inspection Methods. Molex Chengdu plan to do the process change on 47533 series manual assembly line. We will use auto CCD inspection and packaging station to replace current 3 manual stations(Manual CCD inspection 6pin contact height/Gauge check coplanarity/Manual FG packaging machine). All validation is in process and we are expecting to complete the changeover action in the 2016/5/10. This will improve our product's quality performance. | Download |