47553-2001

1.27mm Pitch SIM Card Holder with 2 Detect Pins, 6 Circuits, Push-Push Style, Housing Height 1.80mm, with Pegs, Lead-Free

Elevate your connectivity with our mini-SIM connector, a crucial component designed for seamless integration in electronic devices. Featuring a durable construction with high temperature thermoplastic and stainless steel shell, this connector ensures reliable performance even in demanding environments. With a surface mount termination method and gold-plated copper alloy contacts, it guarantees secure and efficient connections for your mini-SIM cards. Operating within a wide temperature range from -40°C to 85°C, it's suitable for various applications. RoHS compliant and lead-free process capable, it aligns with modern standards for environmental responsibility. Perfect for memory sockets and UIM card connectors, this component is a must-have for your electronic projects.
Availability
Immediate Shipment: NA
Stock Location: In Stock
Factory Stock: Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple: NA/NA
Pricing
CALL: 800.400.7041
Product Category:
Manufacturer: Molex
Manufacturer Part Number: 47553-2001
Series: 47553 - mini-SIM
Amperage: .5 A
Connector Type: mini-SIM
Housing Material: Thermoplastic
Number of Contacts: 6
Termination Method: Surface Mount
Contact Material: Copper Alloy
Contact Plating: Gold over Nickel
Maximum Operating Temperature: 85 °C
Minimum Operating Temperature: -40 °C
Pitch: 2.54 mm
Voltage: 50 V DC
Material: High Temperature Thermoplastic
Shell Material: Stainless Steel
Packaging: Embossed Tape on Reel
Operating Temperature Range: -40 - 85 °C
Contact Mating Area Plating: Gold over Nickel
Contact Mating Area Plating Thickness: 2.54 mm
Number of Contacts Loaded: 6
Mating Cycles: 2500
PCB Locator: Yes
Shielded: Yes
PCB Retention: Yes
Contact Termination Plating Thickness: 1.27 mm
Contact Termination Plating: Gold
Maximum Solder Process Temperature: 250 °C
Lead Free Process Capability: REFLOW
Duration at Max. Process Temperature (seconds): 003
Max. Cycles at Max. Process Temperature: 002
Card Detection Switch: Open
Card Entry Location: Front
Part Aliases: 0475532001
SKU: MOL47553-2001

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes:

Product Change Notice

Effective Date Description of Change Download
01/03/2025 515293 - Packaging method/qty Changing. This notification is to inform you about part(s) listed will undergo changes for packaging size/ packaging specification change. No changes will be made to product as part of this change.
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04/30/2023 513394 - Retraction modification of PCN 512019. this pcn is to make some modifications to the previous pcn 512019 because of resource and strategy adjustment molex decides to suspend alternative material study/qualification on some products during this PCN
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07/14/2022 512019 - Change Supplier. This notification is to inform you about changes that are being made to the part(s) as identified in the list. This change is only the raw material supplier and will not affect fit, form or function. Download
03/16/2022 511324 - Change supplier. Add Alternative resin Materials "WOTE LCP KD130i" Change reason is due to existing resin supplier polyplastics capacity constraint issue. we must qualify local LCP supplier WOTE to avoid production line down. Download
08/01/2021 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. Download
06/01/2021 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately.
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06/30/2016 GCM 10739344 - Change In Packaging Specifications. The purpose of this letter is to inform you that we will improve the packing method for nylon plastic bag. it includes: for SIM/TF series: Add vacuum packing bag and suggestion label on the bag, and also add desiccant into the bag. for SATA series: change the packing bag to MBB. This change is to prevent the HSG blister risk to improve the quality performance. Download
06/10/2016 GCM 10732806 - Change In Test / Inspection Methods. Molex Chengdu plan to do the process change on 47533 series manual assembly line. We will use auto CCD inspection and packaging station to replace current 3 manual stations(Manual CCD inspection 6pin contact height/Gauge check coplanarity/Manual FG packaging machine). All validation is in process and we are expecting to complete the changeover action in the 2016/5/10. This will improve our product's quality performance. Download