51338-0874
SlimStack Board-to-Board Connector, 0.40mm Pitch, J-Bend Series, Receptacle, 1.50 or 2.00mm Mated Height, 3.40mm Mated Width, 80 Circuits
Part Aliases: Molex 0513380874
The SlimStack Board-to-Board Connector, a versatile solution for your connectivity needs. With a slim 0.40mm pitch and J-Bend Series design, this receptacle offers precision and reliability in a compact form. Featuring 80 circuits and a mated height of 1.50 or 2.00mm, it ensures efficient signal transmission. The surface mount termination method allows for easy installation, while gold contact plating guarantees optimal conductivity. Operating in a wide temperature range from -25 to 85°C, it is suitable for various environments. RoHS compliant and with a lock to the mating part, this connector prioritizes both performance and safety in your applications.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 51338-0874 |
| Color: | Black |
| Series: | 51338 |
| Amperage: | .3 A |
| Connector Type: | SlimStack |
| Gender: | Female |
| Number of Contacts: | 80 |
| Number of Rows: | 2 |
| Mount Type: | Surface Mount |
| Termination Method: | Surface Mount |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Body Orientation: | Straight |
| Pitch: | .4 mm |
| Voltage: | 50 V AC/DC |
| Orientation: | Vertical |
| Operating Temperature Range: | -25 - 85 °C |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Number of Contacts Loaded: | 80 |
| Mating Cycles: | 30 |
| PCB Locator: | No |
| PCB Retention: | Without |
| Polarized to PCB: | No |
| Polarized to Mate: | No |
| Supplier Product Group: | PCB Socket Receptacles |
| Connector System: | Board to Board |
| Contact Termination Plating: | Gold |
| Glow Wire Capable: | No |
| Lock to Mating Part: | Yes |
| Mated Height: | 1.5 mm, 2 mm |
| Mated Width: | 3.4 mm |
| Surface Mount Compatible: | Yes |
| Product Name: | SlimStack |
| Part Aliases: | 0513380874 |
| SKU: | MOL51338-0874 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 02/01/2023 | 512320 - Equipment Transfer, Production Transfer or Rearrangement. Production plant location change - Current : Molex Korea - After : Molex Vietnam * Change reason : To better serve our customers and to leverage our global manufacturing footprint, Molex will relocate production of the 0.4 BTB J-Bend Rec lines from Japan to Molex Vietnam production facility. The transfer will started in Q3 2022 and target to complete in Q1 2023. Buffer stock and capacity tooling will be built as need to ensure a seamless transfer. | Download |
| 10/31/2016 | 501415 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different location. No changes will be made to the product as a result of this move. | Download |