71764-0010
2.54mm Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 10 Circuits, Tin (Sn) Plating
Introducing the C-Grid 71764 Series, a versatile board-to-board and wire-to-board connector designed for high-performance applications. With a 2.54mm pitch and right-angle body orientation, this connector features ten contacts in a two-row configuration, allowing for secure and efficient connections. Rated for 3A and 250V, it ensures reliable power transmission. The contact material of brass and phosphor bronze, along with tin plating, guarantees excellent conductivity and durability. Operating in a wide temperature range from -40 to 105°C, it is suitable for various environments. With features like through-hole termination and stackable design, it offers flexibility in installation. RoHS compliant and lead-free process capable, it meets international standards for environmental responsibility. Whether used in industrial machinery or electronic devices, the C-Grid 71764 Series connector delivers exceptional performance.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 71764-0010 |
| Series: | 71764 - C-Grid |
| Amperage: | 3 A |
| Connector Type: | C-Grid |
| Number of Contacts: | 10 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole |
| Contact Material: | Brass, Phosphor Bronze |
| Body Orientation: | Right Angle |
| Pitch: | 2.54 mm |
| Voltage: | 250 V |
| Orientation: | Right Angle |
| Tail Length: | 2.79 mm |
| Packaging: | Tube |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Tin |
| Contact Mating Area Plating Thickness: | 3.81 µm |
| Number of Contacts Loaded: | 10 |
| Mating Cycles: | 25 |
| PCB Locator: | No |
| PCB Retention: | Without |
| Contact Termination Plating Thickness: | 3.81 µm |
| Polarized to Mate: | No |
| Connector System: | Board to Board, Wire to Board |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 235 °C |
| Lead Free Process Capability: | SMC and Wave |
| Duration at Max. Process Temperature (seconds): | 030 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Glow Wire Capable: | No |
| Lock to Mating Part: | No |
| Stackable: | Yes |
| Breakaway: | Yes |
| Shroud Type: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0717640010 |
| SKU: | MOL71764-0010 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/30/2022 | 511846 - Capacity change or tool replacement Equipment Transfer, Production Transfer or Rearrangement. This notification is to inform about new die tooling fabricate in Malaysia is being added to meet the current and future demands of this product referenced below. This notification also add additional manufacturing location for Unity pin Series. The reason for the change is to secure the supply of Bandolier pin for Molex Malaysia. | Download |