71764-0106
2.54mm Pitch C-Grid Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 6 Circuits, 0.38
The C-Grid 71764 series offers a reliable solution for board-to-board and wire-to-board connections, featuring a 6-pin right angle connector with a 2.54mm pitch. With a current rating of 3A and a voltage rating of 250V, this connector is suitable for various applications. Its gold-plated contact mating area ensures excellent conductivity, while its tin-plated termination offers secure soldering. Operating in temperatures ranging from -40 to 105°C, it is designed for durability. The connector is RoHS compliant, making it environmentally friendly. With features like breakaway capability, stackability, and a mating cycle of 50, it provides convenience and ease of use in electronic assemblies. The C-Grid 71764 series is an essential component for your PCB connector needs.
| Product Category: | |
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| Manufacturer: | Molex |
| Manufacturer Part Number: | 71764-0106 |
| Series: | 71764 - C-Grid |
| Amperage: | 3 A |
| Connector Type: | C-Grid |
| Number of Contacts: | 6 |
| Number of Rows: | 2 |
| Termination Method: | Through Hole |
| Contact Material: | Brass, Phosphor Bronze |
| Body Orientation: | Right Angle |
| Pitch: | 2.54 mm |
| Voltage: | 250 V |
| Orientation: | Right Angle |
| Tail Length: | 2.79 mm |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .381 µm |
| Number of Contacts Loaded: | 6 |
| Mating Cycles: | 50 |
| PCB Locator: | No |
| PCB Retention: | Without |
| Contact Termination Plating Thickness: | 1.905 µm |
| Polarized to Mate: | No |
| Connector System: | Board to Board, Wire to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | SMC and Wave |
| Glow Wire Capable: | No |
| Lock to Mating Part: | No |
| Stackable: | Yes |
| Breakaway: | Yes |
| Shroud Type: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0717640106 |
| SKU: | MOL71764-0106 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/30/2022 | 511846 - Capacity change or tool replacement Equipment Transfer, Production Transfer or Rearrangement. This notification is to inform about new die tooling fabricate in Malaysia is being added to meet the current and future demands of this product referenced below. This notification also add additional manufacturing location for Unity pin Series. The reason for the change is to secure the supply of Bandolier pin for Molex Malaysia. | Download |