74099-0609
SL Wire-to-Board Header, Surface Mount, Single Row, Vertical, 9 Circuits, Tin (Sn) Plating, Packaging Tape and Reel with Pick-and-Place Cap
Enhance your wire-to-board connections with our SL Surface Mount Header. Designed for seamless integration, this single-row connector features nine circuits and a vertical orientation, perfect for compact PCB layouts. With tin plating ensuring reliable conductivity and high-temperature thermoplastic construction for durability, it meets stringent industry standards. Offering a pitch of 2.54mm and a current rating of 3A at 250V, it's ideal for various electronic applications. RoHS compliant and lead-free process capable, it's not only environmentally friendly but also suitable for automated soldering processes, with a maximum temperature of 245°C. Trust in the quality and performance of our SL Header for your next project.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 74099-0609 |
| Color: | Black |
| Series: | 74099 |
| Amperage: | 3 A |
| Connector Type: | SL |
| Number of Contacts: | 9 |
| Number of Rows: | 1 |
| Termination Method: | Surface Mount |
| Contact Material: | Phosphor Bronze |
| Body Orientation: | Straight |
| Pitch: | 2.54 mm |
| Voltage: | 250 V |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Operating Temperature Range: | -40 - 105 °C |
| Contact Mating Area Plating: | Tin |
| Contact Mating Area Plating Thickness: | 3.81 µm |
| Number of Contacts Loaded: | 9 |
| Mating Cycles: | 25 |
| Contact Termination Plating Thickness: | 3.81 µm |
| Polarized to Mate: | Yes |
| PCB Thickness (Recommended): | 1.57 mm |
| Connector System: | Wire to Board |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 245 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 040 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Glow Wire Capable: | No |
| Surface Mount Compatible: | Yes |
| Breakaway: | No |
| Shroud Type: | Fully |
| Product Name: | SL |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0740990609 |
| SKU: | MOL74099-0609 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/30/2022 | 511846 - Capacity change or tool replacement Equipment Transfer, Production Transfer or Rearrangement. This notification is to inform about new die tooling fabricate in Malaysia is being added to meet the current and future demands of this product referenced below. This notification also add additional manufacturing location for Unity pin Series. The reason for the change is to secure the supply of Bandolier pin for Molex Malaysia. | Download |
| 08/31/2022 | 511584 - Change Supplier. This notification is to inform you about addition of 899922394 resin (Grade Name: SK Chemicals Skypura 7121F Black) as additional source for 70536 Series. The main reason to add 899922394 resin is to assure the supply of 70536 Series. No changes will be made to product as part of this change. | Download |
| 11/23/2020 | 509053 - Equipment Transfer, Production Transfer or Rearrangement. Molex will relocate production of the SL and C-Grid Product lines from the US & MX to the Molex Malaysia Production facility transfer will start in 2020 and target completion is 2021 buffer stock and capacity tooling will be built as needed to ensure a seamless transition. |
Download |
| 03/31/2020 | 507616 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice is being moved to a different production location. No changes will be made to the product as a result of this move. | Download |