76165-1326

Heilind Number:MOL76165-1326
Manufacturer:Molex
Manufacturer Number:76165-1326
Datasheet:RoHS Certificate of Compliance
ECAD Model:
3D Model

Description:

Impact 100 Ohm 3 Pair Vertical Backplane Header, Unguided, Dual Endwall, 6 Columns, 54 Circuits, Pin Length 4.50mm, Plated Through Hole Dimension 0.39mm, Lead-Free

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Specifications

AttributeValue
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 76165-1326
Color:Black
Series:76165 - Impact
Amperage:.75 A
Connector Type:Impact
Number of Contacts:54
Number of Rows:9
Termination Method:Through Hole - Compliant Pin
Contact Material:High Performance Alloy (HPA)
Contact Plating:Gold
Maximum Operating Temperature:85 °C
Minimum Operating Temperature:-55 °C
Pitch:1.9 mm
Voltage:30 V AC/DC
Material:High Temperature Thermoplastic
Orientation:Vertical
Impedance:100 Ω
Keying:No
Component Type:PCB Header
Number of Pairs:3-pair
Data Rate:25 Gb/s
Tail Length:1.4 mm
Packaging:Tray
Operating Temperature Range:-55 - 85 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.762 µm
Number of Contacts Loaded:54
Mating Cycles:200
PCB Locator:No
Shielded:No
PCB Retention:Without
Polarized to PCB:No
PCB Thickness (Recommended):1 mm
Number of Columns:6
UL Agency Certification:E29179
Contact Termination Plating:Tin
Termination Pitch:1.9 mm
Guide to Mating Part:No
Stackable:No
Board to Board Configuration:Conventional, Mezzanine
Make First / Break Last:No
Material Flammability Standard:94V-0
Part Aliases:0761651326
SKU:MOL76165-1326

Detailed Description

Enhance your backplane connectivity with our Impact 100 Ohm 3 Pair Vertical Backplane Header. This high-performance component features an unguided design with dual endwalls, offering efficient signal transmission. With 54 circuits and a pin length of 4.50mm, it ensures reliable connections in your PCB assembly. The plated through-hole construction with a dimension of 0.39mm and lead-free composition adheres to quality standards. Operating between -55°C to 85°C, it guarantees durability in diverse environments. Gold contact plating and High Performance Alloy (HPA) material further optimize conductivity. Ideal for applications requiring a data rate of 25 Gb/s, this connector is RoHS compliant, making it a sustainable choice for your projects. Elevate your backplane design with this essential component, perfect for mezzanine and conventional board-to-board configurations.