78727-0001
1.40mm Height Push-Pull micro-SIM Card Socket with Detect Switch, Surface Mount, 6 Circuits, Low-Halogen, Lead-Free
Part Aliases: Molex 0787270001
Enhance your device connectivity with our cutting-edge Micro-SIM Connector from the 78727 series. Designed for seamless integration, this surface-mount component features a durable stainless steel shell and gold-plated copper alloy contacts, ensuring reliable performance in a wide temperature range from -40°C to 85°C. With a maximum amperage of .5A and voltage of 10V DC, it's perfect for micro-SIM card applications. RoHS compliant and lead-free process capable, it offers peace of mind for environmentally conscious projects. Whether for mobile devices or IoT applications, trust in the quality and durability of this essential component.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 78727-0001 |
| Series: | 78727 - micro-SIM |
| Amperage: | .5 A |
| Connector Type: | micro-SIM |
| Number of Contacts: | 6 |
| Termination Method: | Surface Mount |
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold over Nickel |
| Maximum Operating Temperature: | 85 °C |
| Minimum Operating Temperature: | -40 °C |
| Pitch: | 2.54 mm |
| Voltage: | 10 V DC |
| Compatible Card Type: | Micro-SIM |
| Shell Material: | Stainless Steel |
| Packaging: | Embossed Tape on Reel |
| Operating Temperature Range: | -40 - 85 °C |
| Contact Mating Area Plating: | Gold over Nickel |
| Contact Mating Area Plating Thickness: | 2.54 mm |
| Number of Contacts Loaded: | 6 |
| Mating Cycles: | 500 |
| PCB Locator: | No |
| Shielded: | Yes |
| PCB Retention: | Yes |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 003 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Card Detection Switch: | Closed |
| Card Entry Location: | Front |
| Part Aliases: | 0787270001 |
| SKU: | MOL78727-0001 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 01/03/2025 | 515293 - Packaging method/qty Changing. This notification is to inform you about part(s) listed will undergo changes for packaging size/ packaging specification change. No changes will be made to product as part of this change. | Product Change Notice Download |
| 02/27/2022 | 511276 - Change Supplier. add alternative copper materials "YCuT-FX-EH", JPN DOWA HOLDINGS. Current "NKT322 ESH" JPN Nippon alternative: "YCuT-FX-EH", JPN DOWA HOLDINGS. | Product Change Notice Download |
| 09/26/2020 | 508585 - Change to Product. Improvement to metal shell surface plating changing from matte tin to nickel. no impact to form fit or function | Product Change Notice Download |
| 11/18/2017 | 502609 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice are being moved to a different production or shipping location. No changes will be made to the product as a result of this move. | Product Change Notice Download |
| 05/22/2014 | GCM 10634281 - Outsourcing Component Or Subcomponent. Because the order of Micro SIM card connector 78727 series are increase,the machine of insert mold is shortage and can't cover current capacity.The purpose of the change is cover current capacity.So we will copy mold and transfer mold to outsourcing supplier for component on insert mold HSG.The Change is no impact for FG. | Product Change Notice Download |