85510-5120
Modular Jack, Vertical, Top Entry, Surface Mount, 8/8, Solder Tabs, Pick-and-Place Polyimide Tape, 13 Reel
Part Aliases: Molex 0855105120
Enhance connectivity with this top-entry, surface-mount Modular Jack, designed for streamlined PCB integration. Featuring 8/8 configuration with solder tabs, it ensures secure connections in various applications. The pick-and-place polyimide tape and embossed reel packaging facilitate efficient assembly processes. Crafted from durable materials, including high-temperature thermoplastic and gold-plated copper alloy contacts, this RJ45 connector guarantees reliable performance in demanding environments. With a straight body orientation and vertical mount type, it offers versatile installation options. RoHS compliant and lead-free soldering capable, it meets stringent environmental standards. Perfect for networking and telecommunications equipment, this component is a vital addition to any project requiring high-speed data transmission.
Product Category: | |
Manufacturer: | Molex |
Manufacturer Part Number: | Molex 85510-5120 |
Color: | Black |
Series: | 85510 - Modular Jack 8/8 - RJ45 |
Amperage: | 1.5 A |
Connector Type: | Modular Jack 8/8, RJ45 |
Gender: | Female |
Mount Type: | Surface Mount |
Termination Method: | Surface Mount |
Contact Material: | Copper Alloy |
Contact Plating: | Gold over Palladium Nickel |
Body Orientation: | Straight |
Pitch: | 1.02 mm |
Voltage: | 125 V DC |
Material: | High Temperature Thermoplastic |
Number of Ports: | 1 |
Orientation: | Vertical |
Component Type: | PCB Jack |
Packaging: | Embossed Tape on Reel |
Operating Temperature Range: | -40 - 85 °C |
Contact Mating Area Plating: | Gold over Palladium Nickel |
Contact Mating Area Plating Thickness: | .051 µm, 1.016 µm |
Mating Cycles: | 2500 |
PCB Locator: | No |
PCB Retention: | Yes |
Contact Termination Plating Thickness: | 1.905 µm |
Contact Termination Plating: | Tin |
Maximum Solder Process Temperature: | 260 °C |
Lead Free Process Capability: | REFLOW |
Duration at Max. Process Temperature (seconds): | 040 |
Max. Cycles at Max. Process Temperature: | 001 |
Termination Pitch: | 1.27 mm |
Surface Mount Compatible: | Yes |
Waterproof Dustproof: | No |
Non Magnetic: | Yes |
Part Aliases: | 0855105120 |
SKU: | MOL85510-5120 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
---|---|---|
05/17/2022 | 511024 - Change Supplier. Adding Alternate sourcing for the terminal copper strip of modular jack as the existing source has decided manufacturing impacted material. the alternate source will support with better lead time and delivery. this will be a running change and required internal qualification will be done before implementation date. | Download |
03/30/2022 | 511458 - Change to Product. Optimize the tolerance and dimensions for SD drawings of impacted part numbers dont have any changes on the physical product. no impact to customer assembly product fit or function. | Download |
08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download |
06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. | Download |
11/01/2020 | 508199 - Plant closure. Equipment Transfer, Production Transfer or Rearrangement to a different production location. No changes will be made to the product as a result of this move. | Download |
02/15/2016 | GCM 10710576 - Manufacturing Process Change. Molex is changing the plating thickness from (3 to 7 microns) to (2 to 4 microns) on 990010050 material strip for its Modular Jacks product range. | Download |