87713-1005
1.27mm Pitch Serial ATA Host Receptacle, Surface Mount, Vertical, Standard Height, with 1.05mm Plastic Locating Peg, 0.76?m Gold (Au) Selective Plating, without Kapton Tape, Tray Packaging, 22 Circuits, Lead-Free
Part Aliases: Molex 0877131005
Enhance your device's connectivity with our cutting-edge Serial ATA connector. Designed for optimal performance, this surface mount receptacle features 22 contacts in a single row, ensuring seamless data transmission. Crafted from durable copper alloy with gold plating, it guarantees reliable signal conductivity. With a wide operating temperature range of -40 to 105°C, it's suitable for various environments. Its vertical orientation and polarized design offer easy and secure PCB assembly. Compliant with RoHS standards, it's a sustainable choice for your electronic applications. Elevate your system's functionality with our high-quality Serial ATA connector.
| Product Category: | |
| Manufacturer: | Molex |
| Manufacturer Part Number: | Molex 87713-1005 |
| Series: | 87713 - Serial ATA |
| Amperage: | 1.5 A |
| Connector Type: | Serial ATA |
| Number of Contacts: | 22 |
| Number of Rows: | 1 |
| Termination Method: | Surface Mount |
| Contact Material: | Copper Alloy |
| Maximum Operating Temperature: | 105 °C |
| Minimum Operating Temperature: | -40 °C |
| Pitch: | 1.27 mm |
| Voltage: | 30 V |
| Material: | High Temperature Thermoplastic |
| Orientation: | Vertical |
| Packaging: | Tray |
| Operating Temperature Range: | -40 - 105 °C |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 22 |
| Mating Cycles: | 500 |
| PCB Locator: | Yes |
| PCB Retention: | Without |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | 2.54 µm |
| Polarized to Mate: | Yes |
| Supplier Product Group: | PCB Socket Receptacles |
| Connector System: | Board to Board |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 010 |
| Max. Cycles at Max. Process Temperature: | 001 |
| Power and Signal Configuration: | 15 p - 7 s |
| Glow Wire Capable: | No |
| Lock to Mating Part: | Yes |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 0877131005 |
| SKU: | MOL87713-1005 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 08/25/2025 | 516691 - Equipment Transfer, Production Transfer or Rearrangement. Molex Singapore is moving the machines to run SAS products at subcon as part of its business. no coo change as the subcon is located in Singapore | Download |
| 07/31/2015 | GCM 10699704 - Tooling / Equipment Transfer. | Download |