95503-2882

Modular Jack, Vertical, Top Entry, Through Hole, 8/8, With Key Version, Tray

Elevate your connectivity with our Vertical Modular Jack. Designed for top entry installation on PCBs, this RJ45 connector features a robust construction with gold-plated copper alloy contacts for reliable signal transmission. With a straight body orientation and through-hole termination, it ensures secure mounting on your circuit board. The black high temperature thermoplastic housing is UL certified, guaranteeing safety and durability in extreme environments. Each connector is tray-packaged and RoHS compliant, meeting stringent quality standards. Ideal for Ethernet and fiber optic applications, it offers a pitch of 1.02mm and supports up to 1.5A of current at 125V DC. Trust in its performance, with a minimum of 2500 mating cycles and compatibility with lead-free soldering processes. Upgrade your networking infrastructure with this essential component.
Availability
Immediate Shipment: NA
Stock Location: In Stock
Factory Stock: Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple: NA/NA
Pricing
CALL: 800.400.7041
Product Category:
Manufacturer: Molex
Manufacturer Part Number: 95503-2882
Color: Black
Series: 95503 - Modular Jack 8/8 - RJ45
Amperage: 1.5 A
Connector Type: Modular Jack 8/8, RJ45
Gender: Female
Mount Type: Surface Mount
Termination Method: Through Hole
Contact Material: Copper Alloy
Contact Plating: Gold over Palladium Nickel
Body Orientation: Straight
Pitch: 1.02 mm
Voltage: 125 V DC
Material: High Temperature Thermoplastic
Number of Ports: 1
Orientation: Vertical
Keying: Yes
Component Type: PCB Jack
Packaging: Tray
Operating Temperature Range: -40 - 85 °C
Contact Mating Area Plating: Gold over Palladium Nickel
Contact Mating Area Plating Thickness: .051 µm, 1.016 µm
Mating Cycles: 2500
PCB Locator: Yes
PCB Retention: Yes
Contact Termination Plating Thickness: 1.905 µm
PCB Thickness (Recommended): 1.57 mm
UL Agency Certification: E107635
Contact Termination Plating: Tin
Maximum Solder Process Temperature: 260 °C
Lead Free Process Capability: WAVE
Duration at Max. Process Temperature (seconds): 005
Max. Cycles at Max. Process Temperature: 001
Termination Pitch: 1.27 mm
Surface Mount Compatible: Yes
Waterproof Dustproof: No
Non Magnetic: Yes
Material Flammability Standard: 94V-0
Part Aliases: 0955032882
SKU: MOL95503-2882

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes:

Product Change Notice

Effective Date Description of Change Download
01/15/2024 514672 - Retraction of PCN 514070. Because of resource and strategy adjustment molex decides to suspend tray material study. qualification on some products during this PCN Download
12/15/2023 514070 - Packaging Method/Quantity Changing. To unify the packaging tray material & improve tray quality, we are moving away from using PS to PET.
Download
05/17/2022 511024 - Change Supplier. Adding Alternate sourcing for the terminal copper strip of modular jack as the existing source has decided manufacturing impacted material. the alternate source will support with better lead time and delivery. this will be a running change and required internal qualification will be done before implementation date. Download
03/30/2022 511458 - Change to Product. Optimize the tolerance and dimensions for SD drawings of impacted part numbers dont have any changes on the physical product. no impact to customer assembly product fit or function. Download
08/01/2021 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. Download
06/01/2021 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately.
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11/01/2020 508199 - Plant closure. Equipment Transfer, Production Transfer or Rearrangement to a different production location. No changes will be made to the product as a result of this move.
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