Hirose BM57 Series Low-Profile Hybrid FPC-to-Board Connector

Hirose BM57 Series low-profile hybrid FPC-to-board connector features a miniature footprint to meet the demand for smaller, thinner connectors that simplify designs and enable size reduction of consumer and other portable devices. The BM57 series offers a fully-armored design to prevent housing damage, an easy mating operation with a wide self-alignment range, and multi-point soldering that enhances PCB peeling strength. The BM57 series has an insert molded header and receptacle design for solder wicking prevention. Additionally, the BM57 has a low-profile design of 0.3 mm pitch, 0.6 mm stacking height, and 1.9 mm width along with a high power supply capacity supporting 5 A for power contact, and 0.3 A for signal contact.