Molex NeoScale High-Speed Mezzanine System
Ideal for space-constrained designs with limited PCB real estate, the modular NeoScale mezzanine system provides a durable and easily customizable design tool for high-density system applications. Each NeoScale triad wafer is an independent element in the housing and can be customized to a design layout.
With four triad wafer configurations, customers can mix and match components to build a mezzanine solution to meet their requirements for signals supporting high-speed differential pairs (85 and 100 ohm), high speed single-ended transmissions, low-speed single-ended signals and power contacts.
- Modular triad wafer design with four triad configurations for high-speed differential pairs, single-ended and power requirements
- Housing design based on honeycomb construction
- High-speed triad wafers comprise three pins per differential pair
- Connectors feature 246 circuits with a density of 82 differential pairs per square inch
- Mirror-image triad layout enables the PCB routing in one or two layers for four- and six-row housings respectively
- Medical Electronics
- Industrial (non-Robotics)
- Computer / Datacom / Telecommunications
- Military / Aerospace / Aviation
Hubs, Servers, NAS towers, Rack mount servers, Personality cards, High data rate scanning
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| NeoScale High-Speed Mezzanine Receptacle, 2.80mm Pitch, 6x12, 72 Triads (216 Circuits), 18.00mm Connector Height, 0.76?m Gold (Au) Plating | |||
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| Minimum: NA | Multiple: NA | ||
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| IMPACT 3X16 100-OHM OPEN ELEVATED DC | |||