Enhance signal connectivity with this MICT 900PLUG assembly, featuring 266 contact positions in a dual-row configuration. Compliant with CSA standards and UL 94V-0 flammability requirements, this board-mount connector is ideal for high-speed data transmission up to 10 Gb/s. Constructed with LCP housing and gold or palladium nickel plating on the contact mating area, it ensures reliable performance in demanding environments. With a pitch of 0.64 mm (.025 in) and a compact vertical mount orientation, it offers efficient PCB integration. The connector's 50 Ω impedance, 30 V AC, and 7 V DC voltage ratings, along with 11.5 A contact amperage, make it suitable for various signal applications. Featuring a stackable design and mezzanine board-to-board configuration, it allows for versatile assembly options. With mating retention, PCB alignment, and locating posts for secure installation, this connector guarantees a stable and durable connection. RoHS compliance and ECCN EAR99 classification further ensure its environmental and export suitability. Perfect for data and device connectivity, this inline connector is a reliable solution for your electronic assembly needs.
Availability
Immediate Shipment: NA
Stock Location: In Stock
Factory Stock: Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple: 1/1
Pricing
CALL: 800.400.7041
Product Category:
Manufacturer: TE Connectivity
Manufacturer Part Number: 2-767017-1
Housing Material: LCP (Liquid Crystal Polymer)
Number of Rows: 2
Mount Type: Board Mount
Termination Method: Surface Mount
Contact Material: Copper Alloy
Pitch: .025 in, .64 mm
Voltage: 30 V AC, 7 V DC
Contact Type: Pin
Row Spacing: .228 in, 5.79 mm
Impedance: 50 Ω
Package Quantity: 5
Contact Amperage: 11.5 A
Number of Positions: 266
Data Rate: 10 Gb/s
Housing Color: Black
Mount Orientation: Vertical
Insulation Resistance: 2 MΩ
GPL: 481
Packaging: Box & Tube, Tube
Operating Temperature Range: -67 - 257 °F
Circuit Application: Signal
Contact Mating Area Plating: Gold or Palladium Nickel or Performance Based
Contact Mating Area Plating Thickness: 30 µin, .76 µm
PCB Retention: With
PCB Contact Termination Area Plating: Tin-Lead
PCB Thickness (Recommended): 1.57 mm, .8 in
Connector Height: 22.657 mm, .892 in
Sealable: No
Ground Component Type: Ground Bus
Mating Alignment: Without
GPL Description: Data and Devices
Connector and Contact Terminate To: Printed Circuit Board
Product Code: 2435
Number of Columns: 133
Number of Power Positions: 7
Number of Signal Positions: 266
Contact Layout: Inline
Connector Length: 101.6 mm, 4 in
Connector System: Board to Board
CSA Agency Certification: 1195944
UL Agency Certification: E28476
Stackable: Yes
ECCN: EAR99
Board to Board Configuration: Mezzanine
Contact Shape: Dual Beam
Connector Width: .32 in, 8.128 mm
Mating Retention: With
PCB Mount Alignment: With
PCB Mount Alignment Type: Locating Posts
Application Assembly Feature: None
Differential Signaling: Yes
Header Type: Header Only
Connector Assembly Type: PCB Mount Header
Stack Height: 1.255 in, 22.86 mm, 31.9 mm
PCB Contact Termination Area Plating Thickness: 150 - 250 µin
Standards Met: CSA
Material Flammability Standard: UL 94V-0
Part Aliases: 2-767017-1
SKU: AMP2-767017-1

Environmental Initiative Details

Environmental Initiative: RoHS
Compliant: Unknown
Date of this Information: Unknown
Notes: