| Effective Date | Description of Change | Download |
|---|
| 04/01/2025 | P-25-027601 - Manufacturing Location Change. Assembly location change. Following Part Numbers will be transferred from TE Outside Vendor to other TE Outside Vendor. Only assembly process will be transfered. All components and that tooling is made in TE in house. After assembly process in outside vendor, The product will return back to TE plant and we inspect it with our procedure.
| Download |
| 06/27/2023 | PCN-23-173100 - Supplier Change. shell change manufacuturing to new plating plant location. Along with that, the laser DC mark are changed of shell. please refer to attachment for detail. the change does not effect any Function.
| Download |
| 06/13/2023 | PCN-23-172183 - Plating Supplier Change. shell used for SIM card PN 2822541-1 change manufacturing to new plating supplier. Along with that, the laser DC mark are changed of shell. please refer to attachment for detail. the change does not effect any Function. | Download |
| 04/21/2023 | PCN-23-173075-C - Cancellation of Plating Supplier Change. it is not to change plating supplier. it is changing plating plant location within same supplier. so we will distribute new PCN with correct description after cancel latest PCN-23-172150 by this Cancellation.
| Download |
| 08/31/2022 | PCN-22-147147 - Manufacturing location change. Due to business increase, QD plant need new production line enter and plant space is limited, to support customer demand well, we plan outsourcing some projects. Estimated transfer schedule will be on the end of Aug. For Simcard project, only Assy line location changed to supplier which near QD plant, other process all keep as before. The new manufacturing location is under a certified quality management system according the standard industry requirements. An internal release based on specifications will executed before any parts will be delivered which guarantees the performance. | Download |
