5223513-1
2MMFB,IS,ASY,024,SIG,HDR,SL
Introducing the Z-PACK Future Bus+ Board-to-Board PCB Connector, a high-performance solution for signal transmission in electronic devices. With a current rating of 3A and a voltage capacity of 30V AC, this connector is designed for reliable power delivery. Featuring a right-angle orientation, it ensures efficient space utilization on the PCB. The 24 gold-plated contacts offer low impedance and high conductivity, meeting the demands of data and device connectivity. With UL 94V-0 housing material and a wide operating temperature range, this connector guarantees durability in various environments. Ideal for board stacking applications, it facilitates seamless signal transmission with its matrix contact layout. RoHS compliant, it upholds environmental standards while delivering exceptional performance. Upgrade your electronic designs with the Z-PACK Future Bus+ Connector for optimal connectivity.
| Product Category: | |
|---|---|
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | 5223513-1 |
| Series: | Z-PACK Future Bus+ |
| Amperage: | 3 A |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 4 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold over Palladium Nickel |
| Body Orientation: | Right Angle |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Pin |
| Impedance: | 24 Ω |
| Package Quantity: | 49 |
| Contact Amperage: | 3 A |
| Number of Positions: | 24 |
| Housing Color: | Natural |
| Mount Orientation: | Right Angle |
| Insulation Resistance: | 4 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .08 µm, 3.1496 µin |
| PCB Retention: | With |
| Contact Underplating Material: | Nickel |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | .08 in, 1.3 mm |
| Connector Height: | 11.2 mm, .44 in |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 2370 |
| Number of Signal Positions: | 24 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Right Angle |
| Contact Mating Area Plating Finish: | Matte |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .107 in, 2.73 mm |
| Connector Assembly Type: | PCB Mount Header |
| PCB Contact Termination Area Plating Thickness: | 150 µin, 3.81 µm |
| Contact Mating Area Length: | .197 in, 5 mm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5223513-1 |
| SKU: | AMP5223513-1 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |