5747836-4
09 MSFL RCPT RA 590 (IN,FM,BL)
Enhance your connectivity solutions with our versatile D-Sub receptacle, featuring UL 94V-0 compliance for top-notch safety. Designed for board mount installation, this connector boasts two rows of nine gold-plated contacts, ensuring reliable signal transmission. Crafted with high-quality phosphor bronze, it offers superior durability for long-lasting performance. With a pitch of 2.74mm and a standard profile, it's ideal for various applications. The front metal shell adds an extra layer of protection, while RoHS compliance underscores our commitment to environmental responsibility. Upgrade your connectivity with this essential component.
| Product Category: | |
|---|---|
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | 5747836-4 |
| Amperage: | 6 A |
| Gender: | Receptacle |
| Number of Contacts: | 9 |
| Number of Rows: | 2 |
| Mount Type: | Board Mount |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Pitch: | 2.74 mm |
| Number of Positions: | 9 |
| Profile: | Standard |
| Shell Type: | Front Metal Shell |
| Standards Met: | UL 94V-0 |
| SKU: | AMP5747836-4 |
| Plastic: | No |
| Shell Plating Material: | Tin |
| Insert Material: | Zinc |
| Eyelet Plating Material: | Tin |
| Eyelet Material: | Brass |
| Post Size: | .66 mm / .026 in |
| Shell Material: | Carbon Steel |
| Preloaded: | Yes |
| PCB Mount Orientation: | Right Angle |
| Contact Underplating Material: | Nickel |
| PCB Contact Termination Area Plating Material: | Tin |
| Contact Mating Area Plating Thickness: | 30 µin |
| Contact Base Material: | Phosphor Bronze |
| Contact Shape and Form: | Round |
| PCB Thickness (Recommended): | .062 in / 1.57 mm |
| Centerline (Pitch): | .108 in / 2.74 mm |
| Housing Color: | Black |
| Housing Material: | Polyester GF / Nylon GF |
| UL Flammability Rating: | UL 94V-0 |
| Mounting Hole Diameter: | .125 in / 3.18 mm |
| PCB Mount Retention: | With |
| Threaded Insert Plating Material: | Clear Chromate |
| Mating Connector Lock Type: | Threaded Inserts, 4-40 UNC |
| PCB Mounting Style: | Through Hole |
| Threaded Insert Material: | Zinc |
| Mating Connector Lock: | With |
| Panel Mount Feature: | Without |
| Boardlock Material: | Copper Alloy |
| Boardlock Plating Material: | Tin |
| Connector Mounting Type: | Board Mount |
| PCB Mount Retention Type: | Boardlock |
| Circuit Application: | Signal |
| Connector System: | Board-to-Board |
| Sealable: | No |
| Grounding Indents: | Without |
| Shielded: | No |
| Shell Size: | 1 |
| Row-to-Row Spacing: | .112 in / 2.84 mm |
| Connector and Contact Terminates To: | Printed Circuit Board |
| Footprint: | 14.99 mm / .59 in |
| Grounded: | No |
| Grounding Straps: | With |
| Product Type: | Connector |
| Termination Post Length: | 3.18 mm / .125 in |
| Grounding Clips: | Without |
| Operating Temperature Range: | -55 - 105 °C / -67 - 221 °F |
| Supplier Product: | PCB D-Sub Connectors |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 10/01/2021 | P-21-020809 - Manufacturing Location Change. The Data and Devices business unit of TE Connectivity ( TE ) is moving its current manufacturing site in Hermosillo, MX to a new manufacturing site in the same city of Hermosillo, MX. The new site is only approximately 3.5 mi (equivalent to approximately 5 km) away from the current site. We plan to migrate all the existing manufacturing equipment relating to the products listed below from our current site to the new site. | Download |
| 10/30/2017 | P-17-014029 - Manufacturing Location Change. TE Connectivity (TE) is moving manufacturing location of the products listed below from TE Hermosillo to TE Guangdong. Please contact your TE Sales Engineer with questions. | Download |
| 04/01/2013 | Project Lantern PTP Migration Parts - MNF. location change from NC. | Download |