5747843-4
37 MSFL PLUG RA 318 (IN,FM,BL)
Enhance your electronic connections with this high-quality D-Sub connector, featuring a total of 37 gold-plated contacts for optimal conductivity. With a UL 94V-0 rating, it ensures superior safety and reliability in operation. The board mount design and threaded insert mating retention offer secure installation, while the front metal shell adds durability. Each contact is crafted from brass with a gold flash over palladium nickel plating, guaranteeing long-lasting performance. With a pitch of 2.77mm and a standard profile, it is suitable for a wide range of applications. Packaged in a convenient tray, this connector is RoHS compliant, meeting the latest environmental standards. Upgrade your connectivity solutions with this advanced D-Sub connector.
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5747843-4 |
| Amperage: | 6 A |
| Gender: | Plug |
| Number of Contacts: | 37 |
| Number of Rows: | 2 |
| Mount Type: | Board Mount |
| Contact Material: | Brass |
| Contact Plating: | Gold, Gold Flash over Palladium Nickel |
| Pitch: | 2.77 mm |
| Number of Positions: | 37 |
| Profile: | Standard |
| Mating Retention Type: | Threaded Insert |
| Packaging: | Tray |
| Shell Type: | Front Metal Shell |
| Standards Met: | UL 94V-0 |
| SKU: | AMP5747843-4 |
| Eyelet Material: | Brass |
| Plastic: | No |
| Shell Material: | Carbon Steel |
| Eyelet Plating Material: | Tin over Copper Flash |
| Post Size: | .026 in / .66 mm |
| Insert Material: | Zinc |
| Shell Plating Material: | Tin |
| PCB Mount Orientation: | Right Angle |
| Preloaded: | Yes |
| Contact Mating Area Plating Thickness: | 30 µin |
| Contact Shape and Form: | Round |
| PCB Contact Termination Area Plating Material: | Tin |
| Contact Base Material: | Brass |
| PCB Thickness (Recommended): | .062 in / 1.57 mm |
| Housing Material: | Polyester / Nylon |
| Centerline (Pitch): | 2.77 mm / .109 in |
| Housing Color: | Black |
| UL Flammability Rating: | UL 94V-0 |
| Mating Connector Lock Type: | Threaded Insert, 4-40 UNC |
| PCB Mount Retention Type: | Boardlock |
| Threaded Insert Plating Material: | Clear Chromate |
| Connector Mounting Type: | Board Mount |
| Boardlock Plating Material: | Tin over Nickel |
| Threaded Insert Material: | Zinc |
| Mounting Hole Diameter: | 3.18 mm / .125 in |
| Mating Connector Lock: | With |
| Panel Mount Feature: | Without |
| PCB Mounting Style: | Through Hole |
| Mating Retention: | With |
| PCB Mount Retention: | With |
| Montageausrichtung der Leiterplatte: | With |
| PCB Mount Alignment: | With |
| Boardlock Material: | Copper Alloy |
| Circuit Application: | Signal |
| Footprint: | .318 in / 8.08 mm |
| Grounding Indents: | With |
| Connector System: | Board-to-Board |
| Sealable: | No |
| Row-to-Row Spacing: | .112 in / 2.84 mm |
| Connector and Contact Terminates To: | Printed Circuit Board |
| Grounded: | Yes |
| Grounding Straps: | With |
| Product Type: | Connector |
| Shell Size: | 4 |
| Termination Post Length: | 3.18 mm / .125 in |
| Grounding Clips: | Without |
| Operating Temperature Range: | -55 - 105 °C / -67 - 221 °F |
| Supplier Product: | PCB D-Sub Connectors |
| Part Alias: | AMP-0-5747843-4,CC2972-000 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/31/2022 | P-22-023406 - Packaging Change. Improved packaging method and quality of package. © 2020 TE Connectivity. Confidential & Proprietary. Do not reproduce or distribute externally including non-authorized representatives and distributors. Create a sustainable future by limiting print copies, and recycling paper. Proposed package Improved packaging method does not require manual force to secure the tray with a new semi-automatic process. The main objective is to improve the quality of the package. | Product Change Notice Download |
| 10/01/2021 | P-21-020809 - Manufacturing Location Change. The Data and Devices business unit of TE Connectivity ( TE ) is moving its current manufacturing site in Hermosillo, MX to a new manufacturing site in the same city of Hermosillo, MX. The new site is only approximately 3.5 mi (equivalent to approximately 5 km) away from the current site. We plan to migrate all the existing manufacturing equipment relating to the products listed below from our current site to the new site. | Product Change Notice Download |
| 10/30/2017 | P-17-014029 - Manufacturing Location Change. TE Connectivity (TE) is moving manufacturing location of the products listed below from TE Hermosillo to TE Guangdong. Please contact your TE Sales Engineer with questions. | Product Change Notice Download |
| 04/01/2013 | Project Lantern PTP Migration Parts - MNF. location change from NC. | Product Change Notice Download |
| 01/02/2013 | P-12-008571 - On solder-tail exit side of connector housing (opposite side of connector from mating face), add full length alignment rib between circuits for solder-tails on upper row of contacts. Current parts only have partial alignment ribs located on the upper end and low end of the solder-tails. | Product Change Notice Download |