151105-0003
0.50mm Pitch DDR4 miniDIMM Socket, Surface Mount, Vertical, with Natural (Off-White) Latches, with Center Forklock, with Pick and Place Cap, 288 Circuits
Enhance your system's memory performance with our cutting-edge DDR4 MiniDIMM socket. Designed for seamless surface mount installation, this high-quality connector features a durable Liquid Crystal Polymer housing and Copper Alloy contacts plated with Gold over Nickel for optimal conductivity. With 288 contacts and a voltage rating of 29V AC/DC, it ensures reliable power delivery in a wide operating temperature range from -55°C to 85°C. Compliant with RoHS standards, it offers eco-friendly lead-free soldering capabilities. Trust in its UL and CSA agency certifications for added assurance of quality and safety. Perfect for use in a variety of electronic applications, this DIMM socket is a versatile and essential component for your memory connectivity needs.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 151105-0003 |
| Series: | 151105 - DDR4 MiniDIMM |
| Amperage: | .75 A |
| Connector Type: | DDR4 MiniDIMM |
| Housing Material: | Liquid Crystal Polymer |
| Number of Contacts: | 288 |
| Mount Type: | Surface Mount |
| Termination Method: | Surface Mount |
| Contact Material: | Copper Alloy |
| Contact Plating: | Gold over Nickel |
| Maximum Operating Temperature: | 85 °C |
| Pitch: | .5 mm |
| Voltage: | 29 V AC/DC |
| Material: | Liquid Crystal Polymer |
| Socket Type: | DIMM |
| Keying: | No |
| SDRAM Type: | DDR4 |
| Component Type: | Socket |
| Housing Color: | Black |
| Packaging: | Tray |
| Operating Temperature Range: | -55 - 85 °C |
| Contact Mating Area Plating: | Gold over Nickel |
| Contact Mating Area Plating Thickness: | .762 µm |
| Number of Contacts Loaded: | 288 |
| Mating Cycles: | 25 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Contact Termination Plating Thickness: | 2.540 µm |
| CSA Agency Certification: | LR19980 |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin over Nickel |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 005 |
| Max. Cycles at Max. Process Temperature: | 002 |
| Voltage Key: | 1.2 V |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 1511050003 |
| SKU: | MOL151105-0003 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 05/31/2024 | 514849 - Change to Product. Latch structure of DDR4 miniDIMM vertical connector has been strengthened to reduce the risk of breakage during actuation. This change will not affect the Fit, Form, Function. Minor changes on the appearance shall be done. | Download |
| 08/01/2021 | 510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. | Download |
| 06/01/2021 | 510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately. |
Download |
| 07/20/2019 | 507212 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change. | Download |