170382-0001
zSFP+ Assembly, Right-Angle, Surface Mount, 20 Circuits, 0.38?m Gold (Au), Tin Tails
Elevate your high-speed connectivity with our zSFP+ Assembly, designed for optimal performance in demanding environments. This right-angle, surface-mount connector features 20 gold-plated circuits, ensuring reliable signal transmission. With a rugged black housing and female gender, it's perfect for industrial applications. The brass and phosphor bronze contacts are plated with gold for enhanced conductivity, while tin tails offer secure termination. Operating at up to 30V AC/DC and 0.5A, this connector is suitable for a wide range of power and data transmission needs. Its compact form factor, with a .8mm pitch and right-angle orientation, allows for efficient PCB integration. Certified to meet RoHS standards, it's also environmentally friendly. Whether you're designing networking equipment or high-speed devices, this zSFP+ Assembly guarantees top-notch performance and durability.
| Product Category: | |
|---|---|
| Manufacturer: | Molex |
| Manufacturer Part Number: | 170382-0001 |
| Color: | Black |
| Series: | 170382 - zSFP Plus - zSFP |
| Amperage: | .5 A |
| Connector Type: | zSFP Plus |
| Gender: | Female |
| Number of Rows: | 2 |
| Termination Method: | Surface Mount |
| Contact Material: | Brass, Phosphor Bronze |
| Contact Plating: | Gold |
| Body Orientation: | Right Angle |
| Pitch: | .8 mm |
| Voltage: | 30 V AC/DC |
| Material: | Thermoplastic |
| Orientation: | Right Angle |
| Keying: | No |
| Component Type: | I/O Plug Connector Subassembly |
| Packaging: | Reel |
| Operating Temperature Range: | -40 - 85 °C |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .381 µm |
| Ground to Panel / PCB: | No |
| Number of Contacts Loaded: | 20 |
| Mating Cycles: | 100 |
| PCB Locator: | Yes |
| PCB Retention: | Yes |
| Polarized to PCB: | Yes |
| Contact Termination Plating Thickness: | .381 µm |
| Polarized to Mate: | Yes |
| PCB Thickness (Recommended): | 1.57 mm |
| Supplier Product Group: | High Speed Cage & Connector Assemblies |
| Connector System: | Module to Board |
| UL Agency Certification: | E29179 |
| Contact Termination Plating: | Tin |
| Maximum Solder Process Temperature: | 260 °C |
| Lead Free Process Capability: | REFLOW |
| Duration at Max. Process Temperature (seconds): | 015 |
| Max. Cycles at Max. Process Temperature: | 003 |
| Termination Pitch: | .8 mm |
| Electrical Model: | Yes |
| Lock to Mating Part: | No |
| Surface Mount Compatible: | Yes |
| Waterproof Dustproof: | No |
| Material Flammability Standard: | 94V-0 |
| Part Aliases: | 1703820001 |
| SKU: | MOL170382-0001 |
Environmental Initiative Details
| Environmental Initiative: | RoHS |
|---|---|
| Compliant: | Unknown |
| Date of this Information: | Unknown |
| Notes: |
Product Change Notice
| Effective Date | Description of Change | Download |
|---|---|---|
| 12/30/2023 | 513862 - Packaging Method/Quantity Changing. In order to internal process improve & improve quality, change the SPQ/box is from 960pcs to 1920pcs. |
Download |
| 11/27/2022 | 512025 - Change To Product. This notification is to inform you about changes that are being made to the part(s) as identified in the list. This change is only the raw material supplier and will not affect fit, form or function. Molex has identified a shortage risk of resin supply which would create a challenge to fulfill orders therefore a new LCP resin has been identified for relative product. | Download |
| 07/01/2020 | 508674 - Capacity change or tool replacement. Molex Chengdu will be adding the ZSFP PLASTIC HOUSING 20KT capacity mold to support increasing demand. | Download |
| 02/17/2020 | 508159 - Production Location Change. Molex Chengdu will add local qualified vendor as stamping source, then will ve able to run terminal production in both locations of Molex Chengdu & local qualified stamping vendor. No impact to fit, form or function. | Download |
| 07/04/2019 | 506624 - Capacity change or tool replacement. another set of tooling is being added to meet the current and future demands of this product. |
Download |
| 05/26/2019 | 505745 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change. | Download |
| 12/16/2018 | 506163 - Manufacturing Process Change. This letter is to inform you that the manufacturing process for the part(s) identified in this notice is changing. No changes will be made to the product as a result of this process change. | Download |
| 07/26/2018 | 502820 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice are being moved to a different production or shipping location. No changes will be made to the product as a result of this move. | Download |
| 04/30/2015 | GCM 10657723 - Product Component Change. | Download |
| 08/03/2014 | GCM 10640994 - New, Modified, Or Replacement Tooling. The purpose of the change is new stamping die build from 1rowx1up to 2rowx1up and the reason of change is for supporting customer increasing monthly demand and mitigate constraint of press machine. No form, fit, function impacted on products. | Download |