170382-0001

zSFP+ Assembly, Right-Angle, Surface Mount, 20 Circuits, 0.38?m Gold (Au), Tin Tails

Part Aliases: Molex 1703820001  
Elevate your high-speed connectivity with our zSFP+ Assembly, designed for optimal performance in demanding environments. This right-angle, surface-mount connector features 20 gold-plated circuits, ensuring reliable signal transmission. With a rugged black housing and female gender, it's perfect for industrial applications. The brass and phosphor bronze contacts are plated with gold for enhanced conductivity, while tin tails offer secure termination. Operating at up to 30V AC/DC and 0.5A, this connector is suitable for a wide range of power and data transmission needs. Its compact form factor, with a .8mm pitch and right-angle orientation, allows for efficient PCB integration. Certified to meet RoHS standards, it's also environmentally friendly. Whether you're designing networking equipment or high-speed devices, this zSFP+ Assembly guarantees top-notch performance and durability.
Availability
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL:800.400.7041
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 170382-0001
Color:Black
Series:170382 - zSFP Plus - zSFP
Amperage:.5 A
Connector Type:zSFP Plus
Gender:Female
Number of Rows:2
Termination Method:Surface Mount
Contact Material:Brass, Phosphor Bronze
Contact Plating:Gold
Body Orientation:Right Angle
Pitch:.8 mm
Voltage:30 V AC/DC
Material:Thermoplastic
Orientation:Right Angle
Keying:No
Component Type:I/O Plug Connector Subassembly
Operating Temperature Range:-40 - 85 °C
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.381 µm
Ground to Panel / PCB:No
Number of Contacts Loaded:20
Mating Cycles:100
PCB Locator:Yes
PCB Retention:Yes
Polarized to PCB:Yes
Contact Termination Plating Thickness:.381 µm
Polarized to Mate:Yes
PCB Thickness (Recommended):1.57 mm
Supplier Product Group:High Speed Cage & Connector Assemblies
Connector System:Module to Board
Contact Termination Plating:Tin
Maximum Solder Process Temperature:260 °C
Lead Free Process Capability:REFLOW
Duration at Max. Process Temperature (seconds):015
Max. Cycles at Max. Process Temperature:003
Termination Pitch:.8 mm
Electrical Model:Yes
Lock to Mating Part:No
Surface Mount Compatible:Yes
Waterproof Dustproof:No
Material Flammability Standard:94V-0
Part Aliases:1703820001
SKU:MOL170382-0001

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
12/30/2023513862 - Packaging Method/Quantity Changing. In order to internal process improve & improve quality, change the SPQ/box is from 960pcs to 1920pcs.
Download
11/27/2022512025 - Change To Product. This notification is to inform you about changes that are being made to the part(s) as identified in the list. This change is only the raw material supplier and will not affect fit, form or function. Molex has identified a shortage risk of resin supply which would create a challenge to fulfill orders therefore a new LCP resin has been identified for relative product.Download
07/01/2020508674 - Capacity change or tool replacement. Molex Chengdu will be adding the ZSFP PLASTIC HOUSING 20KT capacity mold to support increasing demand.Download
02/17/2020508159 - Production Location Change. Molex Chengdu will add local qualified vendor as stamping source, then will ve able to run terminal production in both locations of Molex Chengdu & local qualified stamping vendor. No impact to fit, form or function.Download
07/04/2019506624 - Capacity change or tool replacement. another set of tooling is being added to meet the current and future demands of this product.
Download
05/26/2019505745 - Supplier Change. This letter is to inform you that Molex is adding a new supplier or the supplier is making a change affecting the part(s) identified in this notice. There will be no negative impact to product performance as a result of this change.Download
12/16/2018506163 - Manufacturing Process Change. This letter is to inform you that the manufacturing process for the part(s) identified in this notice is changing. No changes will be made to the product as a result of this process change.Download
07/26/2018502820 - Equipment Transfer, Production Transfer or Rearrangement. This letter is to inform you that production of the part(s) identified in this notice are being moved to a different production or shipping location. No changes will be made to the product as a result of this move.Download
04/30/2015GCM 10657723 - Product Component Change.Download
08/03/2014GCM 10640994 - New, Modified, Or Replacement Tooling. The purpose of the change is new stamping die build from 1rowx1up to 2rowx1up and the reason of change is for supporting customer increasing monthly demand and mitigate constraint of press machine. No form, fit, function impacted on products.Download