170432-0002

zQuad Small Form Factor Pluggable Plus (zQSFP+) Assembly, Surface Mount, 38 Circuits, Gold (Au) Plated 0.762?m, Supports QSFP28 / EDR

Part Aliases: Molex 1704320002  
The zQuad Small Form Factor Pluggable Plus (zQSFP+) Assembly, a high-performance solution for your connectivity needs. Designed for surface mount installation, this assembly features 38 gold-plated circuits with a pitch of 0.8mm, ensuring reliable signal transmission. Supporting QSFP28 and EDR technologies, it is ideal for high-speed applications. The black thermoplastic housing is durable and meets flammability standards, while the copper alloy contacts provide excellent conductivity. With a voltage rating of 30V AC/DC and a current rating of .5A, this assembly offers safe and efficient power delivery. Its right-angle orientation and PCB retention capability make it easy to integrate into your design. RoHS compliant and UL certified, you can trust in the quality and reliability of this component for your projects. Whether used in board-to-board, wire-to-board, or module-to-board connections, the zQSFP+ Assembly is a versatile and essential component in high-speed communication systems.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL:800.400.7041
Product Category:
Manufacturer:Molex
Manufacturer Part Number:Molex 170432-0002
Color:Black
Series:170432 - zQSFP Plus - zQSFP
Amperage:.5 A
Connector Type:zQSFP Plus
Number of Rows:1
Termination Method:Surface Mount
Contact Material:Copper Alloy
Pitch:.8 mm
Voltage:30 V AC/DC
Material:Thermoplastic
Number of Ports:1
Orientation:Right Angle
Keying:No
Component Type:Receptacle
Packaging:Embossed Tape on Reel
Contact Mating Area Plating:Gold over Nickel
Contact Mating Area Plating Thickness:.762 µm
Ground to Panel / PCB:Yes
Number of Contacts Loaded:38
Mating Cycles:50
PCB Retention:Yes
Supplier Product Group:High Speed Cage & Connector Assemblies
Connector System:Board to Board, Module to Board, Wire to Board
UL Agency Certification:E29179
Electrical Model:Yes
Lock to Mating Part:Yes
Material Flammability Standard:94V-0
Part Aliases:1704320002
SKU:MOL170432-0002

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
01/31/2024514009 - Packaging Method/Quantity Changing. This notification is to inform you about the following changes that are being made to the packaging of ZQSFP+ SMT Connector . Change: To standardize the packaging for ZQSFP+ connectors, we are moving away from using the corner guides and white bubble form & switching to pink bubble form.Download
10/31/2021510998 - Change Supplier. 2021 has caused a global shortage for various grades of resin. this extraordinary event in conjunction with an already constrained market has cause immediate and severe disruption in the industry due to these supply constraints of LCP marketing molex identified an internal shortage of resin supply which would create a challenege to fulfill all orders therefore an alternative resin has been identified.Download
08/01/2021510134 - Supplier Change. Due to these supply constraints molex identified an internal shortage of resin supply which would create a challenge to fulfill all orders Alternative supplier operated under a certified quality management system. Download
06/01/2021510379 - Retraction of PCN 510134. Due to E471i is the only resin effected and change in Molex Malaysia. This change is impacted for 78171, 78172, 205871, 205872 series only. no change on E130i the retraction is immediately.
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05/31/2021510074 - Supplier Change. An alternative sourcing had been identified for the product families listed to make up for the winter storm supply constraints.Download
06/14/2019506859 - Capacity change or tool replacement. Another set of tooling is being added to meet the current and future demands of this product.
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08/22/2018502865 - Manufacturing Process Change Molex and Suppliers. This letter is to inform you that the manufacturing process for the part(s) identified in this notice is changing. No changes will be made to the product as a result of this process change.Download
06/15/2016GCM 10738433 - Manufacturing Process Change. The purpose of this letter is to inform you that Molex Chengdu will change the assembly method from manually to automatically, this change is to improve the quality performance. We thank you for choose Molex products, you can contact the local sales if any requirement.Download